RG250CK3 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

RG250CK3: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.165 INCHES MINIMUM AND 0.195 INCHES MAXIMUM IN, body_height: 0.040 INCHES MINIMUM AND 0.055 INCHES MAXIMUM IN, body_length: 0.240 INCHES MINIMUM AND 0.270 INCHES MAXIMUM IN, special_features: FORMED LEADS, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND EXPANDABLE AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-435-8313, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

RG250CK3

NSN: 5962-00-435-8313
FSC: 5962 — Microcircuits, Electronic
CAGE: 07933 — FAIRCHILD SEMICONDUCTOR CORP SEMICONDUCTOR DIV HQ (USA)

SPECIFICATIONS

body_width	0.165 INCHES MINIMUM AND 0.195 INCHES MAXIMUM IN
body_height	0.040 INCHES MINIMUM AND 0.055 INCHES MAXIMUM IN
body_length	0.240 INCHES MINIMUM AND 0.270 INCHES MAXIMUM IN
special_features	FORMED LEADS
features_provided	HERMETICALLY SEALED AND MONOLITHIC AND EXPANDABLE AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 200.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	TRIPLE 3 INPUT
inclosure_configuration	FLAT PACK
NSN	5962-00-435-8313

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: TRIPLE 3 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.165 INCHES MINIMUM AND 0.195 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.040 INCHES MINIMUM AND 0.055 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND MONOLITHIC AND EXPANDABLE AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: FLAT PACK

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	TRIPLE 3 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.165 INCHES MINIMUM AND 0.195 INCHES MAXIMUM IN
BODY HEIGHT	0.040 INCHES MINIMUM AND 0.055 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND MONOLITHIC AND EXPANDABLE AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	FLAT PACK
MEMORY DEVICE TYPE	ROM
BODY LENGTH	0.240 INCHES MINIMUM AND 0.270 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 200.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 1

MC2104FReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is RG250CK3?

RG250CK3 is a MICROCIRCUIT,MEMORY.

What parts can replace RG250CK3?

There is 1 known substitute for RG250CK3: MC2104F. Substitute compatibility should be verified for your specific system.

What is the NSN for RG250CK3?

RG250CK3 is cataloged in the U.S. Government catalog under NSN 5962-00-435-8313. This indicates validated use in U.S. government and defense supply chains.

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