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Technical Data Sheet

RF61CK/3 — MICROCIRCUIT,DIGITAL

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

RF61CK/3: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED AND W/ENABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-461-5200, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
RF61CK/3
NSN: 5962-00-461-5200
FSC: 5962 — Microcircuits, Electronic
CAGE: 3B150 — RAYTHEON COMPANY DBA RAYTHEON CO (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
body_length0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
features_providedMONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED AND W/ENABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC AND GLASS
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern10 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
design_function_and_quantity1 FLIP-FLOP, J-K, OR INPUT
NSN5962-00-461-5200
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN RF61CK/3 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 10 INPUT
•
INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
•
DESIGN FUNCTION AND QUANTITY: 1 FLIP-FLOP, J-K, OR INPUT
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
•
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED AND W/ENABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN10 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
DESIGN FUNCTION AND QUANTITY1 FLIP-FLOP, J-K, OR INPUT
BODY WIDTH0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM IN
BODY HEIGHT0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
FEATURES PROVIDEDMONOLITHIC AND HERMETICALLY SEALED AND POSITIVE OUTPUTS AND MEDIUM SPEED AND W/ENABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
CASE OUTLINE SOURCE AND DESIGNATORT0-116 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
BODY LENGTH0.660 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN
SUBSTITUTES & CROSS-REFERENCES 6
15-107506-121Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
RF61CK833BReference document
Same NSN cross-reference
Reference document — Secondary reference
ML566B1Reference document
Same NSN cross-reference
Reference document — Secondary reference
SF61-38Reference document
Same NSN cross-reference
Reference document — Secondary reference
RX5846Reference document
Same NSN cross-reference
Reference document — Secondary reference
RF61CKReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is RF61CK/3?
RF61CK/3 is a MICROCIRCUIT,DIGITAL.
What parts can replace RF61CK/3?
There are 6 known substitutes for RF61CK/3: 15-107506-121, RF61CK833B, ML566B1 and 3 more. Substitute compatibility should be verified for your specific system.
What is the NSN for RF61CK/3?
RF61CK/3 is cataloged in the U.S. Government catalog under NSN 5962-00-461-5200. This indicates validated use in U.S. government and defense supply chains.
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