RF201CK/883C: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.175 INCHES NOMINAL IN, body_height: 0.070 INCHES MAXIMUM IN, body_length: 0.250 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND POSITIVE OUTPUTS AND MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-00-461-5212, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.175 INCHES NOMINAL IN |
| body_height | 0.070 INCHES MAXIMUM IN |
| body_length | 0.250 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND POSITIVE OUTPUTS AND MONOLITHIC |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 200.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| inclosure_configuration | FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-00-461-5212 |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 FLIP-FLOP, J-K, AND INPUT |
| BODY WIDTH | 0.175 INCHES NOMINAL IN |
| BODY HEIGHT | 0.070 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND POSITIVE OUTPUTS AND MONOLITHIC |
| INCLOSURE CONFIGURATION | FLAT PACK |
| CASE OUTLINE SOURCE AND DESIGNATOR | F-1 MIL-M-38510 |
| BODY LENGTH | 0.250 INCHES MAXIMUM IN |