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RELEASE5830 — SEMICONDUCTOR DEVICE,THYRISTOR

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

RELEASE5830: SEMICONDUCTOR DEVICE,THYRISTOR.

The SEMICONDUCTOR DEVICE,THYRISTOR is a the manufacturer industrial component. Key specifications include overall_length: 1.646 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), overall_diameter: 0.650 INCHES MAXIMUM IN, special_features: WEAPON SYSTEM ESSENTIAL, features_provided: HERMETICALLY SEALED CASE, nominal_thread_size: 0.250 INCHES IN. This part is cataloged in the U.S.

Government catalog under NSN 5961-00-372-0567, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
RELEASE5830
NSN: 5961-00-372-0567
NIINs: 003720567, 010796848, 013014831
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 80131 — ELECTRONIC INDUSTRIES ASSOCIATION
SPECIFICATIONS
overall_length1.646 INCHES MAXIMUM IN
mounting_methodTHREADED STUD(S)
overall_diameter0.650 INCHES MAXIMUM IN
special_featuresWEAPON SYSTEM ESSENTIAL
features_providedHERMETICALLY SEALED CASE
nominal_thread_size0.250 INCHES IN
internal_configurationJUNCTION CONTACT
semiconductor_materialSILICON
end_item_identification5895-01-269-3572 AN/MPN-14K LANDING CONTROL CENTRAL; AN/SPN-43B, 43C; FORRESTAL CLASS CV; NIMITZ CLASS CVN; SIMULATOR AN/MPQ-T3
thread_series_designatorUNF
mounting_facility_quantity1
overall_width_across_flats0.544 INCHES MINIMUM AND 0.562 INCHES MAXIMUM IN
NSN5961-00-372-0567
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN RELEASE5830 MFR OEM SEMICONDUCTOR DEVICE,THYRISTOR
KEY FEATURES
•
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 125.0 CELSIUS AMBIENT AIR DEGC
•
MOUNTING FACILITY QUANTITY: 1
•
OVERALL DIAMETER: 0.650 INCHES MAXIMUM IN
•
MOUNTING METHOD: THREADED STUD(S)
•
SEMICONDUCTOR MATERIAL: SILICON
•
INTERNAL CONFIGURATION: JUNCTION CONTACT
•
FEATURES PROVIDED: HERMETICALLY SEALED CASE
TECHNICAL CHARACTERISTICS
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT125.0 CELSIUS AMBIENT AIR DEGC
MOUNTING FACILITY QUANTITY1
OVERALL DIAMETER0.650 INCHES MAXIMUM IN
MOUNTING METHODTHREADED STUD(S)
SEMICONDUCTOR MATERIALSILICON
OVERALL LENGTH0.505 INCHES MAXIMUM IN
INTERNAL CONFIGURATIONJUNCTION CONTACT
FEATURES PROVIDEDHERMETICALLY SEALED CASE
OVERALL WIDTH ACROSS FLATS0.562 INCHES MAXIMUM IN
NOMINAL THREAD SIZE0.250 INCHES IN
SUBSTITUTES & CROSS-REFERENCES 3
2N5207Reference document
Same NSN cross-reference
Reference document — Design control — primary reference
1151053Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
SKT16/12Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is RELEASE5830?
RELEASE5830 is a SEMICONDUCTOR DEVICE,THYRISTOR.
What parts can replace RELEASE5830?
There are 3 known substitutes for RELEASE5830: 2N5207, 1151053, SKT16/12. Substitute compatibility should be verified for your specific system.
What is the NSN for RELEASE5830?
RELEASE5830 is cataloged in the U.S. Government catalog under NSN 5961-00-372-0567. This indicates validated use in U.S. government and defense supply chains.
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