The SEMICONDUCTOR DEVICES,UNITIZED is a the manufacturer industrial component. Key specifications include overall_height: 0.180 INCHES NOMINAL IN, overall_length: 0.260 INCHES NOMINAL IN, mounting_method: TERMINAL, terminal_length: 1.500 INCHES MINIMUM IN, overall_diameter: 0.370 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-835-2904, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_height | 0.180 INCHES NOMINAL IN |
| overall_length | 0.260 INCHES NOMINAL IN |
| mounting_method | TERMINAL |
| terminal_length | 1.500 INCHES MINIMUM IN |
| overall_diameter | 0.370 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED CASE |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| terminal_circle_diameter | 0.190 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN |
| terminal_type_and_quantity | 6 UNINSULATED WIRE LEAD |
| internal_junction_configuration | NPN |
| power_rating_per_characteristic | 1.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| NSN | 5961-00-835-2904 |
| POWER RATING PER CHARACTERISTIC | 1.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 CELSIUS JUNCTION DEGC |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| TERMINAL LENGTH | 1.500 INCHES MINIMUM IN |
| TERMINAL CIRCLE DIAMETER | 0.190 INCHES MINIMUM AND 0.210 INCHES MAXIMUM IN |
| OVERALL DIAMETER | 0.370 INCHES NOMINAL IN |
| MOUNTING METHOD | TERMINAL |
| INTERNAL JUNCTION CONFIGURATION | NPN |
| CURRENT RATING PER CHARACTERISTIC | 500.00 MILLIAMPERES MAXIMUM COLLECTOR CURRENT, DC |