RELEASE3669: SEMICONDUCTOR DEVICE,DIODE.
The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_height: 0.450 INCHES MAXIMUM IN, overall_length: 0.450 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), overall_diameter: 0.390 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the U.S.
Government catalog under NSN 5961-00-007-7659, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_height | 0.450 INCHES MAXIMUM IN |
| overall_length | 0.450 INCHES MAXIMUM IN |
| mounting_method | THREADED STUD(S) |
| overall_diameter | 0.390 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.250 INCHES IN |
| end_item_identification | 2350-01-048-5920 19207 FSCM |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| overall_width_across_flats | 0.667 INCHES MINIMUM AND 0.687 INCHES MAXIMUM IN |
| terminal_type_and_quantity | 1 TAB, SOLDER LUG AND 1 THREADED STUD |
| NSN | 5961-00-007-7659 |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 28.4 MAXIMUM BREAKDOWN VOLTAGE, DC |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 CELSIUS CASE DEGC |
| MOUNTING FACILITY QUANTITY | 1 |
| OVERALL DIAMETER | 0.667 INCHES MAXIMUM IN |
| MOUNTING METHOD | THREADED STUD(S) AND TERMINAL |
| OVERALL LENGTH | 0.450 INCHES MAXIMUM IN |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| OVERALL WIDTH ACROSS FLATS | 0.667 INCHES MINIMUM AND 0.687 INCHES MAXIMUM IN |
| NOMINAL THREAD SIZE | 0.250 INCHES IN |
| CURRENT RATING PER CHARACTERISTIC | 1760.00 MILLIAMPERES MAXIMUM MAXIMUM REVERSE SURGE CURRENT |