The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_height: 0.445 INCHES NOMINAL IN, overall_length: 0.350 INCHES NOMINAL IN, mounting_method: UNTHREADED HOLE(S), overall_diameter: 0.875 INCHES MAXIMUM IN, special_features: INTERNAL JUNCTION CONFIGURATION ARRANGEMENT PNPN. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-052-8556, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | GLASS ENCLOSURE |
| overall_height | 0.445 INCHES NOMINAL IN |
| overall_length | 0.350 INCHES NOMINAL IN |
| mounting_method | UNTHREADED HOLE(S) |
| overall_diameter | 0.875 INCHES MAXIMUM IN |
| special_features | INTERNAL JUNCTION CONFIGURATION ARRANGEMENT PNPN |
| features_provided | HERMETICALLY SEALED CASE |
| nominal_thread_size | 0.190 INCHES IN |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| thread_series_designator | UNF |
| mounting_facility_quantity | 2 |
| NSN | 5961-00-052-8556 |
| OVERALL WIDTH ACROSS FLATS | 0.510 INCHES MAXIMUM IN |
| OVERALL HEIGHT | 0.445 INCHES NOMINAL IN |
| INTERNAL CONFIGURATION | JUNCTION CONTACT |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| TERMINAL TYPE AND QUANTITY | 3 UNINSULATED WIRE LEAD |
| SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: PNP |
| SEMICONDUCTOR MATERIAL | GERMANIUM |