PartsTable
Technical Data Sheet
Download PDF

RELEASE1255 — SEMICONDUCTOR DEVICE,DIODE

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

RELEASE1255: SEMICONDUCTOR DEVICE,DIODE.

The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.620 INCHES MINIMUM AND 0.650 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 0.180 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN, overall_diameter: 0.240 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the U.S.

Government catalog under NSN 5961-00-811-4853, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
RELEASE1255
NSN: 5961-00-811-4853
NIINs: 008114853, 008118462, 008118463
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 80131 — ELECTRONIC INDUSTRIES ASSOCIATION
SPECIFICATIONS
materialSILICON SEMICONDUCTOR
overall_length0.620 INCHES MINIMUM AND 0.650 INCHES MAXIMUM IN
mounting_methodTERMINAL
terminal_length0.180 INCHES MINIMUM AND 0.190 INCHES MAXIMUM IN
overall_diameter0.240 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED CASE
terminal_circle_diameter0.092 INCHES MINIMUM IN
terminal_type_and_quantity1 BINDING POST AND 1 PIN
nondefinitive_spec/std_data1N15OR TYPE
specification/standard_data80131-RELEASE1255 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION
power_rating_per_characteristic1.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION
maximum_operating_temp_per_measurement_point150.0 CELSIUS AMBIENT AIR DEGC
NSN5961-00-811-4853
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN RELEASE1255 MFR OEM SEMICONDUCTOR DEVICE,DIODE
KEY FEATURES
•
FEATURES PROVIDED: HERMETICALLY SEALED CASE
•
NONDEFINITIVE SPEC/STD DATA: 1N15OR TYPE
•
MATERIAL: SILICON SEMICONDUCTOR
•
TERMINAL TYPE AND QUANTITY: 1 BINDING POST AND 1 PIN
TECHNICAL CHARACTERISTICS
FEATURES PROVIDEDHERMETICALLY SEALED CASE
NONDEFINITIVE SPEC/STD DATA1N15OR TYPE
MATERIALSILICON SEMICONDUCTOR
TERMINAL TYPE AND QUANTITY1 BINDING POST AND 1 PIN
SUBSTITUTES & CROSS-REFERENCES 2
210822Reference document
Same NSN cross-reference
Reference document — Secondary reference
1N150RReference document
Same NSN cross-reference
Reference document — Design control — primary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Demilitarization required — critical (Q)
Ready to buy RELEASE1255?
Compare prices from verified sellers on eBay
Buy on eBay →
As an eBay Partner, PartsTable may earn a commission. Your price is not affected.
FREQUENTLY ASKED QUESTIONS
What is RELEASE1255?
RELEASE1255 is a SEMICONDUCTOR DEVICE,DIODE.
What parts can replace RELEASE1255?
There are 2 known substitutes for RELEASE1255: 210822, 1N150R. Substitute compatibility should be verified for your specific system.
What is the NSN for RELEASE1255?
RELEASE1255 is cataloged in the U.S. Government catalog under NSN 5961-00-811-4853. This indicates validated use in U.S. government and defense supply chains.
Community Feedback
Leave a Comment
Comments are reviewed before appearing. You will receive an email to verify before your comment appears.

Request a Quote — RELEASE1255