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Technical Data Sheet
RD31626 ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.230 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.080 INCHES MAXIMUM IN, body_length: 0.350 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND W/CLOCK AND W/RESET, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-448-5511, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
RD31626
NSN: 5962-01-448-5511
FSC: 5962
CAGE: 27014 — NATIONAL SEMICONDUCTOR CORPORATION (USA)
SPECIFICATIONS
body_width0.230 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height0.080 INCHES MAXIMUM IN
body_length0.350 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND W/CLOCK AND W/RESET
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern11 INPUT
end_item_identificationAN/APG-63 RADAR
inclosure_configurationFLAT PACK
terminal_type_and_quantity14 PRINTED CIRCUIT
NSN5962-01-448-5511
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN RD31626 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
MAXIMUM POWER DISSIPATION RATING: 99.0 MILLIWATTS
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
DESIGN FUNCTION AND QUANTITY: 1 FLIP-FLOP, J-K
INCLOSURE CONFIGURATION: FLAT PACK
OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC
BODY HEIGHT: 0.080 INCHES MAXIMUM IN
TERMINAL TYPE AND QUANTITY: 14 PRINTED CIRCUIT
TECHNICAL CHARACTERISTICS (FLIS)
MAXIMUM POWER DISSIPATION RATING99.0 MILLIWATTS
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
DESIGN FUNCTION AND QUANTITY1 FLIP-FLOP, J-K
INCLOSURE CONFIGURATIONFLAT PACK
OUTPUT LOGIC FORMTRANSISTOR-TRANSISTOR LOGIC
END ITEM IDENTIFICATIONAN/APG-63 RADAR
BODY HEIGHT0.080 INCHES MAXIMUM IN
TERMINAL TYPE AND QUANTITY14 PRINTED CIRCUIT
BODY WIDTH0.230 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND W/CLOCK AND W/RESET
VERIFIED SUBSTITUTES & CROSS-REFERENCES 8
MIL-M-38510/2Interchangeable
interchangeable cross-reference
interchangeable
HL61706Interchangeable
interchangeable cross-reference
interchangeable
M38510/00201BDBInterchangeable
interchangeable cross-reference
interchangeable
CW3-44Interchangeable
interchangeable cross-reference
interchangeable
5Z208Interchangeable
interchangeable cross-reference
interchangeable
37-5Z208Interchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is RD31626?
RD31626 is a MICROCIRCUIT,DIGITAL.
What parts can replace RD31626?
There are 8 known substitutes for RD31626: MIL-M-38510/2, HL61706, M38510/00201BDB and 5 more. Substitute compatibility should be verified for your specific system.
What is the NSN for RD31626?
RD31626 is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-448-5511. This indicates validated use in U.S. government and defense supply chains.
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