RB54HCT245L: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.358 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.358 INCHES MAXIMUM IN, features_provided: ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND 3-STATE OUTPUT AND W/ENABLE, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-230-3022, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.358 INCHES MAXIMUM IN |
| body_height | 0.100 INCHES MAXIMUM IN |
| body_length | 0.358 INCHES MAXIMUM IN |
| features_provided | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND 3-STATE OUTPUT AND W/ENABLE |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 18 INPUT |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-230-3022 |
| INPUT CIRCUIT PATTERN | 18 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 8 TRANSCEIVER |
| BODY WIDTH | 0.358 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.100 INCHES MAXIMUM IN |
| FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND 3-STATE OUTPUT AND W/ENABLE |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CASE OUTLINE SOURCE AND DESIGNATOR | C-2 MIL-M-38510 |
| BODY LENGTH | 0.358 INCHES MAXIMUM IN |