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R1109 — SEMICONDUCTOR DEVICE,DIODE

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

R1109: SEMICONDUCTOR DEVICE,DIODE.

The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.440 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), features_provided: HERMETICALLY SEALED CASE, nominal_thread_size: 0.190 INCHES IN, thread_series_designator: UNF. This part is cataloged in the U.S.

Government catalog under NSN 5961-00-086-9237, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
R1109
NSN: 5961-00-086-9237
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 57057 — NAVCOM DEFENSE ELECTRONICS, INC. (USA)
SPECIFICATIONS
materialSILICON SEMICONDUCTOR
overall_length0.440 INCHES MAXIMUM IN
mounting_methodTHREADED STUD(S)
features_providedHERMETICALLY SEALED CASE
nominal_thread_size0.190 INCHES IN
thread_series_designatorUNF
mounting_facility_quantity1
overall_width_across_flats0.438 INCHES NOMINAL IN
terminal_type_and_quantity1 TAB, SOLDER LUG AND 1 UNINSULATED WIRE LEAD
power_rating_per_characteristic10.0 WATTS MAXIMUM TOTAL POWER DISSIPATION
current_rating_per_characteristic2.00 AMPERES MAXIMUM MAXIMUM REVERSE SURGE CURRENT
voltage_rating_in_volts_per_characteristic1.5 MAXIMUM NOMINAL REGULATOR VOLTAGE
NSN5961-00-086-9237
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN R1109 MFR OEM SEMICONDUCTOR DEVICE,DIODE
KEY FEATURES
•
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 1.5 MAXIMUM NOMINAL REGULATOR VOLTAGE
•
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 135.0 CELSIUS AMBIENT AIR DEGC
•
MOUNTING FACILITY QUANTITY: 1
•
MOUNTING METHOD: THREADED STUD(S)
•
FEATURES PROVIDED: HERMETICALLY SEALED CASE
•
OVERALL WIDTH ACROSS FLATS: 0.438 INCHES NOMINAL IN
•
NOMINAL THREAD SIZE: 0.190 INCHES IN
TECHNICAL CHARACTERISTICS
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC1.5 MAXIMUM NOMINAL REGULATOR VOLTAGE
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT135.0 CELSIUS AMBIENT AIR DEGC
MOUNTING FACILITY QUANTITY1
MOUNTING METHODTHREADED STUD(S)
OVERALL LENGTH0.440 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED CASE
OVERALL WIDTH ACROSS FLATS0.438 INCHES NOMINAL IN
NOMINAL THREAD SIZE0.190 INCHES IN
CURRENT RATING PER CHARACTERISTIC2.00 AMPERES MAXIMUM MAXIMUM REVERSE SURGE CURRENT
MATERIALSILICON SEMICONDUCTOR
SUBSTITUTES & CROSS-REFERENCES 1
69-1993Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is R1109?
R1109 is a SEMICONDUCTOR DEVICE,DIODE.
What parts can replace R1109?
There is 1 known substitute for R1109: 69-1993. Substitute compatibility should be verified for your specific system.
What is the NSN for R1109?
R1109 is cataloged in the U.S. Government catalog under NSN 5961-00-086-9237. This indicates validated use in U.S. government and defense supply chains.
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