The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: SILICON, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: LEADLESS FLAT PACK, terminal_type_and_quantity: 28 LEADLESS, part_name_assigned_by_controlling_agency: MICROCIRCUIT, DIGITAL, MEMORY CMOS 8K X 8 UF EPROM. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-666-2623, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | SILICON |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_type_and_quantity | 28 LEADLESS |
| part_name_assigned_by_controlling_agency | MICROCIRCUIT, DIGITAL, MEMORY CMOS 8K X 8 UF EPROM |
| NSN | 5962-01-666-2623 |
| TERMINAL TYPE AND QUANTITY | 28 LEADLESS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| INCLOSURE MATERIAL | SILICON |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT, DIGITAL, MEMORY CMOS 8K X 8 UF EPROM |