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Q67100-R100-Z6 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

Q67100-R100-Z6: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include inclosure_material: CERAMIC, memory_device_type: ROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: DUAL-IN-LINE, terminal_surface_treatment: SOLDER, part_name_assigned_by_controlling_agency: PROGRAMMED 256 X 4 ROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-110-6921, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
Q67100-R100-Z6
NSN: 5962-01-110-6921
FSC: 5962 — Microcircuits, Electronic
CAGE: D1180 — EPCOS AG ABT. PR ROE K PM (DEU)
SPECIFICATIONS
inclosure_materialCERAMIC
memory_device_typeROM
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
part_name_assigned_by_controlling_agencyPROGRAMMED 256 X 4 ROM
voltage_rating_and_type_per_characteristic18.0 VOLTS MAXIMUM POWER SOURCE
NSN5962-01-110-6921
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN Q67100-R100-Z6 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: ROM
•
VOLTAGE RATING AND TYPE PER CHARACTERISTIC: 18.0 VOLTS MAXIMUM POWER SOURCE
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
TERMINAL TYPE AND QUANTITY: 16 PRINTED CIRCUIT
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEROM
VOLTAGE RATING AND TYPE PER CHARACTERISTIC18.0 VOLTS MAXIMUM POWER SOURCE
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
PART NAME ASSIGNED BY CONTROLLING AGENCYPROGRAMMED 256 X 4 ROM
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
SUBSTITUTES & CROSS-REFERENCES 3
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
W41297-B6100-A5Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
MCM14524ALReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is Q67100-R100-Z6?
Q67100-R100-Z6 is a MICROCIRCUIT,MEMORY.
What parts can replace Q67100-R100-Z6?
There are 3 known substitutes for Q67100-R100-Z6: ROM/PROM, W41297-B6100-A5, MCM14524AL. Substitute compatibility should be verified for your specific system.
What is the NSN for Q67100-R100-Z6?
Q67100-R100-Z6 is cataloged in the U.S. Government catalog under NSN 5962-01-110-6921. This indicates validated use in U.S. government and defense supply chains.
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