The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN, body_height: 0.149 INCHES NOMINAL IN, body_length: 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN, overall_height: 0.330 INCHES NOMINAL IN, features_provided: HERMETICALLY SEALED AND W/OPEN COLLECTOR AND HIGH VOLTAGE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-00-390-5157, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| body_width | 0.245 INCHES MINIMUM AND 0.285 INCHES MAXIMUM IN |
| body_height | 0.149 INCHES NOMINAL IN |
| body_length | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| overall_height | 0.330 INCHES NOMINAL IN |
| features_provided | HERMETICALLY SEALED AND W/OPEN COLLECTOR AND HIGH VOLTAGE |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | HEX 1 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-00-390-5157 |
| TERMINAL SURFACE TREATMENT | SOLDER |
| FEATURES PROVIDED | HERMETICALLY SEALED AND W/OPEN COLLECTOR AND HIGH VOLTAGE |
| BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM IN |
| INPUT CIRCUIT PATTERN | HEX 1 INPUT |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MAXIMUM POWER DISSIPATION RATING | 145.0 MILLIWATTS |
| STORAGE TEMP RANGE | -65.0 TO 150.0 CELSIUS DEGC |
| DESIGN FUNCTION AND QUANTITY | 6 BUFFER, HEX |
| OVERALL HEIGHT | 0.330 INCHES NOMINAL IN |