Q00260F: SEMICONDUCTOR DEVICE,THYRISTOR.
The SEMICONDUCTOR DEVICE,THYRISTOR is a the manufacturer industrial component. Key specifications include material: CERAMIC ENCLOSURE, overall_width: 0.469 INCHES NOMINAL IN, overall_height: 1.500 INCHES NOMINAL IN, overall_length: 0.500 INCHES NOMINAL IN, mounting_method: THREADED STUD(S), nominal_thread_size: 0.250 INCHES IN. This part is cataloged in the U.S.
Government catalog under NSN 5961-01-286-7276, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | CERAMIC ENCLOSURE |
| overall_width | 0.469 INCHES NOMINAL IN |
| overall_height | 1.500 INCHES NOMINAL IN |
| overall_length | 0.500 INCHES NOMINAL IN |
| mounting_method | THREADED STUD(S) |
| nominal_thread_size | 0.250 INCHES IN |
| semiconductor_material | SILICON |
| end_item_identification | NON DIRECTIONAL BEACON,RECEIVER MODEL SR115 (NDBSR115) |
| thread_quantity_per_inch | 27 |
| thread_series_designator | UNF |
| mounting_facility_quantity | 1 |
| terminal_type_and_quantity | 2 SOLDER STUD AND 1 CASE |
| NSN | 5961-01-286-7276 |
| OVERALL HEIGHT | 1.500 INCHES NOMINAL IN |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 500.0 MAXIMUM REPETITIVE PEAK OFF-STATE VOLTAGE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 115.0 CELSIUS CASE DEGC |
| MOUNTING FACILITY QUANTITY | 1 |
| JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | SC129 |
| MOUNTING METHOD | THREADED STUD(S) |
| SEMICONDUCTOR MATERIAL | SILICON |
| OVERALL LENGTH | 0.500 INCHES NOMINAL IN |
| OVERALL WIDTH | 0.469 INCHES NOMINAL IN |
| NOMINAL THREAD SIZE | 0.250 INCHES IN |