The SEMICONDUCTOR DEVICE SET is a the manufacturer industrial component. Key specifications include overall_length: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.500 INCHES MINIMUM IN, overall_diameter: 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN, special_features: JUNCTION PATTERN ARRANGEMENT: PNP, features_provided: HERMETICALLY SEALED CASE. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-229-5151, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| overall_length | 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.500 INCHES MINIMUM IN |
| overall_diameter | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM IN |
| special_features | JUNCTION PATTERN ARRANGEMENT: PNP |
| features_provided | HERMETICALLY SEALED CASE |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | GERMANIUM |
| terminal_circle_diameter | 0.200 INCHES NOMINAL IN |
| terminal_type_and_quantity | 3 UNINSULATED WIRE LEAD |
| specification/standard_data | 81349-MIL-S-19500/20 GOVERNMENT SPECIFICATION |
| power_rating_per_characteristic | 150.0 MILLIWATTS MAXIMUM COLLECTOR POWER DISSIPATION |
| NSN | 5961-00-229-5151 |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| SEMICONDUCTOR MATERIAL | SILICON |