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Technical Data Sheet

PLHS18PA/BRA — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

PLHS18PA/BRA: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: BURN IN AND MONOLITHIC AND PROGRAMMED, inclosure_material: CERAMIC, memory_device_type: PAL. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-358-1462, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
PLHS18PA/BRA
NSN: 5962-01-358-1462
FSC: 5962 — Microcircuits, Electronic
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
features_providedBURN IN AND MONOLITHIC AND PROGRAMMED
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern13 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
NSN5962-01-358-1462
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN PLHS18PA/BRA MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 13 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.185 INCHES MAXIMUM IN
•
FEATURES PROVIDED: BURN IN AND MONOLITHIC AND PROGRAMMED
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: PAL
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN13 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT0.185 INCHES MAXIMUM IN
FEATURES PROVIDEDBURN IN AND MONOLITHIC AND PROGRAMMED
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEPAL
CASE OUTLINE SOURCE AND DESIGNATORD-8 MIL-M-38510
BODY LENGTH1.060 INCHES MAXIMUM IN
SUBSTITUTES & CROSS-REFERENCES 6
AMPAL18A/BRAReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8752801RBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-87528Reference document
Same NSN cross-reference
Reference document — Identification reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8752801RASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
5962-8752801RXReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — stock exhausted; no further procurementDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is PLHS18PA/BRA?
PLHS18PA/BRA is a MICROCIRCUIT,MEMORY.
What parts can replace PLHS18PA/BRA?
There are 6 known substitutes for PLHS18PA/BRA: AMPAL18A/BRA, 5962-8752801RB, 5962-87528 and 3 more. Substitute compatibility should be verified for your specific system.
What is the NSN for PLHS18PA/BRA?
PLHS18PA/BRA is cataloged in the U.S. Government catalog under NSN 5962-01-358-1462. This indicates validated use in U.S. government and defense supply chains.
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