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Technical Data Sheet

PL7145556-00 — Technical Data Sheet

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WHAT YOU NEED TO KNOW
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PRODUCT OVERVIEW

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include features_provided: HERMETICALLY SEALED AND BURN IN AND PROGRAMMED, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PAL, storage_temp_range: -65.0 TO 150.0 CELSIUS DEGC, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System under NSN 5962-01-385-9424, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
PL7145556-00
NSN: 5962-01-385-9424
FSC: 5962
CAGE: 90536 — LOCKHEED MARTIN CORP DBA LOCKHEED MARTIN DIV MST - EAGAN (USA)
SPECIFICATIONS
features_providedHERMETICALLY SEALED AND BURN IN AND PROGRAMMED
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
maximum_power_dissipation_rating1.5 WATTS
nuclear_hardness_critical_featureHARDENED
case_outline_source_and_designatorD-9 MIL-M-38510
NSN5962-01-385-9424
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN PL7145556-00 MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
NUCLEAR HARDNESS CRITICAL FEATURE: HARDENED
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND PROGRAMMED
•
TERMINAL SURFACE TREATMENT: SOLDER
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
INCLOSURE MATERIAL: CERAMIC
•
CASE OUTLINE SOURCE AND DESIGNATOR: D-9 MIL-M-38510
•
MEMORY DEVICE TYPE: PAL
TECHNICAL CHARACTERISTICS
INCLOSURE CONFIGURATIONDUAL-IN-LINE
NUCLEAR HARDNESS CRITICAL FEATUREHARDENED
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND PROGRAMMED
TERMINAL SURFACE TREATMENTSOLDER
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
INCLOSURE MATERIALCERAMIC
CASE OUTLINE SOURCE AND DESIGNATORD-9 MIL-M-38510
MEMORY DEVICE TYPEPAL
VOLTAGE RATING AND TYPE PER CHARACTERISTIC7.0 VOLTS MAXIMUM POWER SOURCE
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
VERIFIED SUBSTITUTES & CROSS-REFERENCES 20
PL7145433-00InterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
7538800-00InterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
NHPL7145433-00InterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
PL7145434-00InterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
7358601-00InterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
NHPL7145434-00InterchangeableGOVERNMENT REGISTRY
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVEGOVERNMENT REGISTRY
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is PL7145556-00?
PL7145556-00 is a MICROCIRCUIT,DIGITAL.
What parts can replace PL7145556-00?
There are 20 known substitutes for PL7145556-00: PL7145433-00, 7538800-00, NHPL7145433-00 and 17 more. Substitute compatibility should be verified for your specific system.
What is the NSN for PL7145556-00?
PL7145556-00 is cataloged in the Federal Logistics Information System under NSN 5962-01-385-9424. This indicates validated use in U.S. government and defense supply chains.
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