PALC22V10D-15LMB: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.460 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.460 INCHES MAXIMUM IN, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: PAL. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-441-3611, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.460 INCHES MAXIMUM IN |
| body_height | 0.100 INCHES MAXIMUM IN |
| body_length | 0.460 INCHES MAXIMUM IN |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | PAL |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 22 INPUT |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_type_and_quantity | 28 LEADLESS |
| current_rating_per_characteristic | 15.00 NANOAMPERES NOMINAL SUPPLY |
| voltage_rating_and_type_per_characteristic | 5.0 VOLTS NOMINAL INPUT |
| NSN | 5962-01-441-3611 |
| INPUT CIRCUIT PATTERN | 22 INPUT |
| INCLOSURE MATERIAL | CERAMIC |
| BODY WIDTH | 0.460 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.100 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CURRENT RATING PER CHARACTERISTIC | 15.00 NANOAMPERES NOMINAL SUPPLY |
| MEMORY DEVICE TYPE | PAL |
| BODY LENGTH | 0.460 INCHES MAXIMUM IN |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL INPUT |