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PAL20X10ACJS — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

PAL20X10ACJS: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.246 INCHES MINIMUM AND 0.270 INCHES MAXIMUM IN, body_height: 0.130 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN, body_length: 1.181 INCHES MINIMUM AND 1.211 INCHES MAXIMUM IN, features_provided: BURN IN AND HIGH SLEW RATE AND PROGRAMMED AND ELECTROSTATIC SENSITIVE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-352-1024, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
PAL20X10ACJS
NSN: 5962-01-352-1024
FSC: 5962 — Microcircuits, Electronic
CAGE: 50364 — MMI/AMD (USA)
SPECIFICATIONS
body_width0.246 INCHES MINIMUM AND 0.270 INCHES MAXIMUM IN
body_height0.130 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN
body_length1.181 INCHES MINIMUM AND 1.211 INCHES MAXIMUM IN
features_providedBURN IN AND HIGH SLEW RATE AND PROGRAMMED AND ELECTROSTATIC SENSITIVE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-55.0 TO 125.0 CELSIUS DEGC
operating_temp_range+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern20 INPUT
end_item_identification4935-01-262-0017 TEST SET,GUIDED
inclosure_configurationDUAL-IN-LINE
NSN5962-01-352-1024
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN PAL20X10ACJS MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 20 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.246 INCHES MINIMUM AND 0.270 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.130 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN
•
FEATURES PROVIDED: BURN IN AND HIGH SLEW RATE AND PROGRAMMED AND ELECTROSTATIC SENSITIVE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: PAL
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN20 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.246 INCHES MINIMUM AND 0.270 INCHES MAXIMUM IN
BODY HEIGHT0.130 INCHES MINIMUM AND 0.170 INCHES MAXIMUM IN
FEATURES PROVIDEDBURN IN AND HIGH SLEW RATE AND PROGRAMMED AND ELECTROSTATIC SENSITIVE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEPAL
BODY LENGTH1.181 INCHES MINIMUM AND 1.211 INCHES MAXIMUM IN
STORAGE TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 1
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is PAL20X10ACJS?
PAL20X10ACJS is a MICROCIRCUIT,MEMORY.
What parts can replace PAL20X10ACJS?
There is 1 known substitute for PAL20X10ACJS: ROM/PROM. Substitute compatibility should be verified for your specific system.
What is the NSN for PAL20X10ACJS?
PAL20X10ACJS is cataloged in the U.S. Government catalog under NSN 5962-01-352-1024. This indicates validated use in U.S. government and defense supply chains.
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