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PAL16R8MF883B — MICROCIRCUIT,DIGITAL

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

PAL16R8MF883B: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.410 INCHES MAXIMUM IN, body_height: 0.130 INCHES MAXIMUM IN, body_length: 0.410 INCHES MAXIMUM IN, features_provided: MONOLITHIC, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-227-4546, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
PAL16R8MF883B
NSN: 5962-01-227-4546
FSC: 5962 — Microcircuits, Electronic
CAGE: 50364 — MMI/AMD (USA)
SPECIFICATIONS
body_width0.410 INCHES MAXIMUM IN
body_height0.130 INCHES MAXIMUM IN
body_length0.410 INCHES MAXIMUM IN
features_providedMONOLITHIC
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern9 INPUT
inclosure_configurationFLAT PACK
terminal_surface_treatmentSOLDER
terminal_type_and_quantity20 FLAT LEADS
NSN5962-01-227-4546
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN PAL16R8MF883B MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 9 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
DESIGN FUNCTION AND QUANTITY: 1 ARRAY, LOGIC
•
BODY WIDTH: 0.410 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.130 INCHES MAXIMUM IN
•
FEATURES PROVIDED: MONOLITHIC
•
INCLOSURE CONFIGURATION: FLAT PACK
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN9 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
DESIGN FUNCTION AND QUANTITY1 ARRAY, LOGIC
BODY WIDTH0.410 INCHES MAXIMUM IN
BODY HEIGHT0.130 INCHES MAXIMUM IN
FEATURES PROVIDEDMONOLITHIC
INCLOSURE CONFIGURATIONFLAT PACK
BODY LENGTH0.410 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 2
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
15-513111-3Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is PAL16R8MF883B?
PAL16R8MF883B is a MICROCIRCUIT,DIGITAL.
What parts can replace PAL16R8MF883B?
There are 2 known substitutes for PAL16R8MF883B: ROM/PROM, 15-513111-3. Substitute compatibility should be verified for your specific system.
What is the NSN for PAL16R8MF883B?
PAL16R8MF883B is cataloged in the U.S. Government catalog under NSN 5962-01-227-4546. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.