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PAL16L8JC — MICROCIRCUIT,DIGITAL

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

PAL16L8JC: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.310 INCHES MAXIMUM IN, body_height: 0.185 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND BIPOLAR AND PROGRAMMABLE, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-254-6239, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
PAL16L8JC
NSN: 5962-01-254-6239
NIINs: 012546239, 012902462
FSC: 5962 — Microcircuits, Electronic
CAGE: 27014 — NATIONAL SEMICONDUCTOR CORPORATION (USA)
SPECIFICATIONS
body_width0.310 INCHES MAXIMUM IN
body_height0.185 INCHES MAXIMUM IN
body_length1.060 INCHES MAXIMUM IN
features_providedMONOLITHIC AND BIPOLAR AND PROGRAMMABLE
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern16 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
design_function_and_quantity1 ARRAY, LOGIC
NSN5962-01-254-6239
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN PAL16L8JC MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 5 INPUT
•
INCLOSURE MATERIAL: CERAMIC OR METAL
•
TERMINAL SURFACE TREATMENT: SOLDER
•
DESIGN FUNCTION AND QUANTITY: 1 ARRAY, LOGIC
•
BODY WIDTH: 0.285 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.160 INCHES NOMINAL IN
•
FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND PROGRAMMABLE
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN5 INPUT
INCLOSURE MATERIALCERAMIC OR METAL
TERMINAL SURFACE TREATMENTSOLDER
DESIGN FUNCTION AND QUANTITY1 ARRAY, LOGIC
BODY WIDTH0.285 INCHES MAXIMUM IN
BODY HEIGHT0.160 INCHES NOMINAL IN
FEATURES PROVIDEDMONOLITHIC AND HERMETICALLY SEALED AND PROGRAMMABLE
INCLOSURE CONFIGURATIONDUAL-IN-LINE
BODY LENGTH0.970 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 4
AMPAL16L8LDCReference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
DMPAL16L8JCReference document
Same NSN cross-reference
Reference document — Secondary reference
PAL16L8CJReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is PAL16L8JC?
PAL16L8JC is a MICROCIRCUIT,DIGITAL.
What parts can replace PAL16L8JC?
There are 4 known substitutes for PAL16L8JC: AMPAL16L8LDC, ROM/PROM, DMPAL16L8JC and 1 more. Substitute compatibility should be verified for your specific system.
What is the NSN for PAL16L8JC?
PAL16L8JC is cataloged in the U.S. Government catalog under NSN 5962-01-254-6239. This indicates validated use in U.S. government and defense supply chains.
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