PAL16L8B-4MW/883B — Technical Data Sheet

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— · COMPONENT

WHAT YOU NEED TO KNOW

Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel

Confirm exact part number — similar PNs may be different parts

PRODUCT OVERVIEW

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.540 INCHES MAXIMUM IN, overall_width: 0.745 INCHES MINIMUM AND 1.040 INCHES MAXIMUM IN, overall_length: 0.540 INCHES MAXIMUM IN, features_provided: BIPOLAR AND PROGRAMMABLE AND HIGH IMPEDANCE AND W/CLOCK AND MONOLITHIC. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-351-9537, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

PAL16L8B-4MW/883B

NSN: 5962-01-351-9537
FSC: 5962
CAGE: 50364 — MMI/AMD (USA)

SPECIFICATIONS

body_width	0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height	0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length	0.540 INCHES MAXIMUM IN
overall_width	0.745 INCHES MINIMUM AND 1.040 INCHES MAXIMUM IN
overall_length	0.540 INCHES MAXIMUM IN
features_provided	BIPOLAR AND PROGRAMMABLE AND HIGH IMPEDANCE AND W/CLOCK AND MONOLITHIC
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
test_data_document	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
NSN	5962-01-351-9537

COMPONENT DIAGRAM

KEY FEATURES

•

TEST DATA DOCUMENT: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).

•

INCLOSURE MATERIAL: CERAMIC

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BODY LENGTH: 0.540 INCHES MAXIMUM IN

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INPUT CIRCUIT PATTERN: 14 INPUT

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BODY HEIGHT: 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN

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OUTPUT LOGIC FORM: TRANSISTOR-TRANSISTOR LOGIC

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TIME RATING PER CHACTERISTIC: 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS (FLIS)

TEST DATA DOCUMENT	96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
INCLOSURE MATERIAL	CERAMIC
BODY LENGTH	0.540 INCHES MAXIMUM IN
INPUT CIRCUIT PATTERN	14 INPUT
OVERALL WIDTH	0.745 INCHES MINIMUM AND 1.040 INCHES MAXIMUM IN
BODY HEIGHT	0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
OUTPUT LOGIC FORM	TRANSISTOR-TRANSISTOR LOGIC
TIME RATING PER CHACTERISTIC	50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS
OVERALL LENGTH	0.540 INCHES MAXIMUM IN
BODY WIDTH	0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN

VERIFIED SUBSTITUTES & CROSS-REFERENCES 22

PAL16R6B-4MJ/883BInterchangeable