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Technical Data Sheet

PAL16L8B-2MW/883B — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

PAL16L8B-2MW/883B: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN, body_height: 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.540 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-352-1008, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
PAL16L8B-2MW/883B
NSN: 5962-01-352-1008
FSC: 5962 — Microcircuits, Electronic
CAGE: 50364 — MMI/AMD (USA)
SPECIFICATIONS
body_width0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
body_height0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length0.540 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern16 INPUT
end_item_identification5895-01-299-3419 CONVERTER,SIGNAL DATA
NSN5962-01-352-1008
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN PAL16L8B-2MW/883B MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 16 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
CURRENT RATING PER CHARACTERISTIC: 105.00 MILLIAMPERES MAXIMUM SUPPLY
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN16 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM IN
BODY HEIGHT0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
CURRENT RATING PER CHARACTERISTIC105.00 MILLIAMPERES MAXIMUM SUPPLY
MEMORY DEVICE TYPEPAL
CASE OUTLINE SOURCE AND DESIGNATORF-9 MIL-M-38510
SUBSTITUTES & CROSS-REFERENCES 6
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8515505SXReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-8515505SASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
5962-8515505SBReference document
Same NSN cross-reference
Reference document — Secondary reference
5962-85155Reference document
Same NSN cross-reference
Reference document — Identification reference
TIBPAL16L8-30MWBReference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure
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FREQUENTLY ASKED QUESTIONS
What is PAL16L8B-2MW/883B?
PAL16L8B-2MW/883B is a MICROCIRCUIT,MEMORY.
What parts can replace PAL16L8B-2MW/883B?
There are 6 known substitutes for PAL16L8B-2MW/883B: ROM/PROM, 5962-8515505SX, 5962-8515505SA and 3 more. Substitute compatibility should be verified for your specific system.
What is the NSN for PAL16L8B-2MW/883B?
PAL16L8B-2MW/883B is cataloged in the U.S. Government catalog under NSN 5962-01-352-1008. This indicates validated use in U.S. government and defense supply chains.
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