PartsTable
Technical Data Sheet

PAL14H4ML/883 — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

PAL14H4ML/883: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, features_provided: BURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-263-0989, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
PAL14H4ML/883
NSN: 5962-01-263-0989
FSC: 5962 — Microcircuits, Electronic
CAGE: 50364 — MMI/AMD (USA)
SPECIFICATIONS
body_width0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
body_height0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
body_length0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
features_providedBURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
test_data_document96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern14 INPUT
inclosure_configurationLEADLESS FLAT PACK
NSN5962-01-263-0989
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN PAL14H4ML/883 MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 14 INPUT
•
INCLOSURE MATERIAL: CERAMIC
•
TERMINAL SURFACE TREATMENT: SOLDER
•
BODY WIDTH: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
•
FEATURES PROVIDED: BURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED
•
INCLOSURE CONFIGURATION: LEADLESS FLAT PACK
•
MEMORY DEVICE TYPE: PAL
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN14 INPUT
INCLOSURE MATERIALCERAMIC
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
BODY HEIGHT0.060 INCHES MINIMUM AND 0.100 INCHES MAXIMUM IN
FEATURES PROVIDEDBURN IN AND BIPOLAR AND MONOLITHIC AND PROGRAMMED
INCLOSURE CONFIGURATIONLEADLESS FLAT PACK
MEMORY DEVICE TYPEPAL
CASE OUTLINE SOURCE AND DESIGNATORC-2 MIL-M-38510
BODY LENGTH0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN
OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic
Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.
5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909
SUBSTITUTES & CROSS-REFERENCES 6
81035Reference document
Same NSN cross-reference
Reference document — Identification reference
81035032BReference document
Same NSN cross-reference
Reference document — Secondary reference
ROM/PROMReference document
Same NSN cross-reference
Reference document — Secondary reference
G104653-822Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
81035032XReference document
Same NSN cross-reference
Reference document — Secondary reference
81035032ASame NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is PAL14H4ML/883?
PAL14H4ML/883 is a MICROCIRCUIT,MEMORY.
What parts can replace PAL14H4ML/883?
There are 6 known substitutes for PAL14H4ML/883: 81035, 81035032B, ROM/PROM and 3 more. Substitute compatibility should be verified for your specific system.
What is the NSN for PAL14H4ML/883?
PAL14H4ML/883 is cataloged in the U.S. Government catalog under NSN 5962-01-263-0989. This indicates validated use in U.S. government and defense supply chains.
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✓ PartsTable — the parts reference. Every fact cited to its source.
PartsTable Design LLC · partstable.com
U.S. Government catalog: edition PUBLOGDVD v12.0.0 (OCT 2026), edition date 2026-10-01, retrieved 2026-10-18.
PartsTable commercial catalog: edition Unified commercial catalog snapshot through 2026-09-28, edition date not on file, retrieved 2026-09-28.