PAL10L8-2MJ — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

PAL10L8-2MJ: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.300 INCHES MAXIMUM IN, body_height: 0.175 INCHES MAXIMUM IN, body_length: 0.990 INCHES MAXIMUM IN, features_provided: BURN IN AND MONOLITHIC AND PROGRAMMED AND SCHOTTKY, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-322-6663, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

PAL10L8-2MJ

NSN: 5962-01-322-6663
FSC: 5962 — Microcircuits, Electronic
CAGE: 50364 — MMI/AMD (USA)

SPECIFICATIONS

body_width	0.300 INCHES MAXIMUM IN
body_height	0.175 INCHES MAXIMUM IN
body_length	0.990 INCHES MAXIMUM IN
features_provided	BURN IN AND MONOLITHIC AND PROGRAMMED AND SCHOTTKY
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	PAL
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-322-6663

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.300 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.175 INCHES MAXIMUM IN

•

FEATURES PROVIDED: BURN IN AND MONOLITHIC AND PROGRAMMED AND SCHOTTKY

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: PAL

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.300 INCHES MAXIMUM IN
BODY HEIGHT	0.175 INCHES MAXIMUM IN
FEATURES PROVIDED	BURN IN AND MONOLITHIC AND PROGRAMMED AND SCHOTTKY
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	PAL
BODY LENGTH	0.990 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 3

128EDCC00779-1Reference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROM FAMILY 073Reference document

Same NSN cross-reference

Reference document — Secondary reference

128EDCA00737-1Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation

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FREQUENTLY ASKED QUESTIONS

What is PAL10L8-2MJ?

PAL10L8-2MJ is a MICROCIRCUIT,MEMORY.

What parts can replace PAL10L8-2MJ?

There are 3 known substitutes for PAL10L8-2MJ: 128EDCC00779-1, ROM/PROM FAMILY 073, 128EDCA00737-1. Substitute compatibility should be verified for your specific system.

What is the NSN for PAL10L8-2MJ?

PAL10L8-2MJ is cataloged in the U.S. Government catalog under NSN 5962-01-322-6663. This indicates validated use in U.S. government and defense supply chains.

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