P8755A — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

P8755A: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN, body_height: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN, body_length: 2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN, bit_quantity: 16384, word_quantity: 2048, features_provided: HERMETICALLY SEALED AND ERASABLE AND HIGH SPEED AND PROGRAMMABLE AND W/CLOCK AND W/RESET. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-130-4020, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

P8755A

NSN: 5962-01-130-4020
FSC: 5962 — Microcircuits, Electronic
CAGE: 34649 — INTEL CORP SALES OFFICE (USA)

SPECIFICATIONS

body_width	0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
body_height	0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
body_length	2.030 INCHES MINIMUM AND 2.080 INCHES MAXIMUM IN
bit_quantity	16384
word_quantity	2048
features_provided	HERMETICALLY SEALED AND ERASABLE AND HIGH SPEED AND PROGRAMMABLE AND W/CLOCK AND W/RESET
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	35 INPUT
NSN	5962-01-130-4020

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 16384

•

INPUT CIRCUIT PATTERN: 35 INPUT

•

WORD QUANTITY: 2048

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED AND ERASABLE AND HIGH SPEED AND PROGRAMMABLE AND W/CLOCK AND W/RESET

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	16384
INPUT CIRCUIT PATTERN	35 INPUT
WORD QUANTITY	2048
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.515 INCHES MINIMUM AND 0.600 INCHES MAXIMUM IN
BODY HEIGHT	0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED AND ERASABLE AND HIGH SPEED AND PROGRAMMABLE AND W/CLOCK AND W/RESET
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM

SUBSTITUTES & CROSS-REFERENCES 4

C8755AReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

8755AReference document

Same NSN cross-reference

Reference document — Advisory reference — outside the item-of-supply concept

D8755AReference document

Same NSN cross-reference

Reference document — Secondary reference

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Demilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is P8755A?

P8755A is a MICROCIRCUIT,MEMORY.

What parts can replace P8755A?

There are 4 known substitutes for P8755A: C8755A, 8755A, D8755A and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for P8755A?

P8755A is cataloged in the U.S. Government catalog under NSN 5962-01-130-4020. This indicates validated use in U.S. government and defense supply chains.

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