The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.300 INCHES MAXIMUM IN, body_height: 0.100 INCHES MAXIMUM IN, body_length: 0.540 INCHES MAXIMUM IN, overall_height: 0.400 INCHES MAXIMUM IN, overall_length: 1.060 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND TRUE/COMPLEMENTARY. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-505-4207, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.300 INCHES MAXIMUM IN |
| body_height | 0.100 INCHES MAXIMUM IN |
| body_length | 0.540 INCHES MAXIMUM IN |
| overall_height | 0.400 INCHES MAXIMUM IN |
| overall_length | 1.060 INCHES MAXIMUM IN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND TRUE/COMPLEMENTARY |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| inclosure_configuration | FLAT PACK |
| NSN | 5962-01-505-4207 |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| BODY WIDTH | 0.300 INCHES MAXIMUM IN |
| INCLOSURE MATERIAL | CERAMIC |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND TRUE/COMPLEMENTARY |
| CURRENT RATING PER CHARACTERISTIC | 6.00 MILLIAMPERES MAXIMUM SUPPLY |
| TIME RATING PER CHACTERISTIC | 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY NS |
| MAXIMUM POWER DISSIPATION RATING | 500.0 MILLIWATTS |
| OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| OVERALL HEIGHT | 0.400 INCHES MAXIMUM IN |