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P4C164-25CMB — MICROCIRCUIT,MEMORY

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

P4C164-25CMB: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include special_features: SPEED ACCESS 25.0 SECONDS, features_provided: HIGH SPEED AND LOW POWER AND STATIC OPERATION, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC, memory_device_type: RAM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-347-0385, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
P4C164-25CMB
NSN: 5962-01-347-0385
FSC: 5962 — Microcircuits, Electronic
CAGE: 75569 — PERFORMANCE SEMICONDUCTOR CORP (USA)
SPECIFICATIONS
special_featuresSPEED ACCESS 25.0 SECONDS
features_providedHIGH SPEED AND LOW POWER AND STATIC OPERATION
output_logic_formCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_materialCERAMIC
memory_device_typeRAM
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
inclosure_configurationDUAL-IN-LINE
terminal_type_and_quantity28 PIN
NSN5962-01-347-0385
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,MEMORY TITLE COMPONENT PN P4C164-25CMB MFR MICROCIRCUIT,MEMORY
KEY FEATURES
•
INCLOSURE MATERIAL: CERAMIC
•
FEATURES PROVIDED: HIGH SPEED AND LOW POWER AND STATIC OPERATION
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: RAM
•
OUTPUT LOGIC FORM: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
•
OPERATING TEMP RANGE: -55.0 TO 125.0 CELSIUS DEGC
•
TERMINAL TYPE AND QUANTITY: 28 PIN
TYPICAL APPLICATIONS
  • Server memory expansion for virtualization workloads
  • Database performance optimization (in-memory computing)
  • VDI and remote desktop session hosting
  • High-performance computing (HPC) clusters
  • Mail server and collaboration platform scaling
  • Application server tier expansion
TECHNICAL CHARACTERISTICS
INCLOSURE MATERIALCERAMIC
FEATURES PROVIDEDHIGH SPEED AND LOW POWER AND STATIC OPERATION
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPERAM
OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
SPECIAL FEATURESSPEED ACCESS 25.0 SECONDS
OPERATING TEMP RANGE-55.0 TO 125.0 CELSIUS DEGC
TERMINAL TYPE AND QUANTITY28 PIN
SUBSTITUTES & CROSS-REFERENCES 2
10129515Reference document
Same NSN cross-reference
Reference document — Informative reference only
SSM7164-30SMBReference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)
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FREQUENTLY ASKED QUESTIONS
What is P4C164-25CMB?
P4C164-25CMB is a MICROCIRCUIT,MEMORY.
What parts can replace P4C164-25CMB?
There are 2 known substitutes for P4C164-25CMB: 10129515, SSM7164-30SMB. Substitute compatibility should be verified for your specific system.
What is the NSN for P4C164-25CMB?
P4C164-25CMB is cataloged in the U.S. Government catalog under NSN 5962-01-347-0385. This indicates validated use in U.S. government and defense supply chains.
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