The RELAY ASSEMBLY GROUP is a the manufacturer industrial component. Key specifications include overall_length: 0.260 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.500 INCHES MINIMUM IN, overall_diameter: 0.370 INCHES MAXIMUM IN, special_features: JUNCTION PATTERN ARRANGEMENT: NPN, features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-00-768-2049, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| overall_length | 0.260 INCHES MAXIMUM IN |
| mounting_method | TERMINAL |
| terminal_length | 1.500 INCHES MINIMUM IN |
| overall_diameter | 0.370 INCHES MAXIMUM IN |
| special_features | JUNCTION PATTERN ARRANGEMENT: NPN |
| features_provided | HERMETICALLY SEALED CASE |
| internal_configuration | JUNCTION CONTACT |
| semiconductor_material | SILICON |
| terminal_circle_diameter | 0.200 INCHES NOMINAL IN |
| terminal_type_and_quantity | 3 UNINSULATED WIRE LEAD |
| specification/standard_data | 80131-RELEASE3961 PROFESSIONAL/INDUSTRIAL ASSOCIATION SPECIFICATION |
| power_rating_per_characteristic | 1.0 WATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| NSN | 5961-00-768-2049 |
| TERMINAL CIRCLE DIAMETER | 0.200 INCHES NOMINAL IN |
| INTERNAL CONFIGURATION | JUNCTION CONTACT |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| TERMINAL LENGTH | 1.500 INCHES MINIMUM IN |
| ELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASE | COLLECTOR |
| MOUNTING METHOD | TERMINAL |
| OVERALL DIAMETER | 0.370 INCHES MAXIMUM IN |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 120.0 MAXIMUM COLLECTOR TO BASE VOLTAGE/STATIC/EMITTER OPEN AND 80.0 MAXIMUM COLLECTOR-TO-EMITTER, RESISTANCE BETWEEN BASE AND EMITTER AND 65.0 MAXIMUM COLLECTOR TO EMITTER VOLTAGE/STATIC/BASE OPEN AND 7.0 MAXIMUM EMITTER TO BASE VOLTAGE, STATIC, COLLECTOR OPEN |
| SEMICONDUCTOR MATERIAL | SILICON |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 CELSIUS JUNCTION DEGC |