NMC93C06EN — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

NMC93C06EN: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.255 INCHES MAXIMUM IN, body_height: 0.180 INCHES MAXIMUM IN, body_length: 0.400 INCHES MAXIMUM IN, bit_quantity: 256, word_quantity: 16, features_provided: ERASABLE AND PROGRAMMABLE AND HIGH SPEED AND LOW POWER. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-355-1139, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

NMC93C06EN

NSN: 5962-01-355-1139
FSC: 5962 — Microcircuits, Electronic
CAGE: 27014 — NATIONAL SEMICONDUCTOR CORPORATION (USA)

SPECIFICATIONS

body_width	0.255 INCHES MAXIMUM IN
body_height	0.180 INCHES MAXIMUM IN
body_length	0.400 INCHES MAXIMUM IN
bit_quantity	256
word_quantity	16
features_provided	ERASABLE AND PROGRAMMABLE AND HIGH SPEED AND LOW POWER
output_logic_form	COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	EEPROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-40.0 TO 85.0 CELSIUS DEGC
input_circuit_pattern	3 INPUT
NSN	5962-01-355-1139

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 256

•

INPUT CIRCUIT PATTERN: 3 INPUT

•

WORD QUANTITY: 16

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.255 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: ERASABLE AND PROGRAMMABLE AND HIGH SPEED AND LOW POWER

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	256
INPUT CIRCUIT PATTERN	3 INPUT
WORD QUANTITY	16
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.255 INCHES MAXIMUM IN
BODY HEIGHT	0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	ERASABLE AND PROGRAMMABLE AND HIGH SPEED AND LOW POWER
INCLOSURE CONFIGURATION	DUAL-IN-LINE
CURRENT RATING PER CHARACTERISTIC	3.00 MILLIAMPERES MAXIMUM SUPPLY

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 2

NM93C06ENSame NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

ROM/PROMReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

No demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is NMC93C06EN?

NMC93C06EN is a MICROCIRCUIT,MEMORY.

What parts can replace NMC93C06EN?

There are 2 known substitutes for NMC93C06EN: NM93C06EN, ROM/PROM. Substitute compatibility should be verified for your specific system.

What is the NSN for NMC93C06EN?

NMC93C06EN is cataloged in the U.S. Government catalog under NSN 5962-01-355-1139. This indicates validated use in U.S. government and defense supply chains.

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