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Technical Data Sheet
NE556A ✓ Verified by PartsTable
· COMPONENT
WHAT YOU NEED TO KNOW
Verify manufacturer and server generation compatibility Check if Option PN or Spare PN — same part, different channel
Confirm exact part number — similar PNs may be different parts
PRODUCT OVERVIEW

The SEMICONDUCTOR DEVICE SET is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 0.785 INCHES MAXIMUM IN, special_features: WEAPON SYSTEM ESSENTIAL, features_provided: HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND RESETTABLE AND RETRIGGERABLE, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.

This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-041-2554, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
NE556A
NSN: 5962-01-041-2554
FSC: 5962
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)
SPECIFICATIONS
body_width0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length0.785 INCHES MAXIMUM IN
special_featuresWEAPON SYSTEM ESSENTIAL
features_providedHERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND RESETTABLE AND RETRIGGERABLE
inclosure_materialCERAMIC AND GLASS
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_patternDUAL 4 INPUT
inclosure_configurationDUAL-IN-LINE
terminal_surface_treatmentSOLDER
terminal_type_and_quantity14 PRINTED CIRCUIT
NSN5962-01-041-2554
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available SEMICONDUCTOR DEVICE SET TITLE COMPONENT PN NE556A MFR SEMICONDUCTOR DEVICE S
KEY FEATURES
TERMINAL SURFACE TREATMENT: SOLDER
BODY HEIGHT: 2.92 MILLIMETERS MINIMUM AND 3.18 MILLIMETERS MAXIMUM MM
BODY LENGTH: 18.92 MILLIMETERS MINIMUM AND 19.18 MILLIMETERS MAXIMUM MM
BODY WIDTH: 6.22 MILLIMETERS MINIMUM AND 6.40 MILLIMETERS MAXIMUM MM
OPERATING TEMP RANGE: +0.0 TO 70.0 CELSIUS DEGC
MAXIMUM POWER DISSIPATION RATING: 600.0 MILLIWATTS
INCLOSURE CONFIGURATION: DUAL-IN-LINE
STORAGE TEMP RANGE: -65.0 TO 150.0 CELSIUS DEGC
TECHNICAL CHARACTERISTICS (FLIS)
TERMINAL SURFACE TREATMENTSOLDER
BODY HEIGHT2.92 MILLIMETERS MINIMUM AND 3.18 MILLIMETERS MAXIMUM MM
BODY LENGTH18.92 MILLIMETERS MINIMUM AND 19.18 MILLIMETERS MAXIMUM MM
BODY WIDTH6.22 MILLIMETERS MINIMUM AND 6.40 MILLIMETERS MAXIMUM MM
OPERATING TEMP RANGE+0.0 TO 70.0 CELSIUS DEGC
MAXIMUM POWER DISSIPATION RATING600.0 MILLIWATTS
INCLOSURE CONFIGURATIONDUAL-IN-LINE
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
INCLOSURE MATERIALPLASTIC
INPUT CIRCUIT PATTERNDUAL 2 WIDE 2 INPUT
VERIFIED SUBSTITUTES & CROSS-REFERENCES 13
213871G001Interchangeable
interchangeable cross-reference
interchangeable
3214006-001-538Interchangeable
interchangeable cross-reference
interchangeable
321069P1Interchangeable
interchangeable cross-reference
interchangeable
RA3047Interchangeable
interchangeable cross-reference
interchangeable
NE556AInterchangeable
interchangeable cross-reference
interchangeable
M38510/10902BCAInterchangeable
interchangeable cross-reference
interchangeable
LIFECYCLE
StatusACTIVE
AvailabilityOEM and secondary market
RoHS CompliantEAR99ESD SensitiveNot HAZMAT
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FREQUENTLY ASKED QUESTIONS
What is NE556A?
NE556A is a SEMICONDUCTOR DEVICE SET.
What parts can replace NE556A?
There are 13 known substitutes for NE556A: 213871G001, 3214006-001-538, 321069P1 and 10 more. Substitute compatibility should be verified for your specific system.
What is the NSN for NE556A?
NE556A is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-041-2554. This indicates validated use in U.S. government and defense supply chains.
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