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N82S153F — MICROCIRCUIT,DIGITAL

✓ Government record, cited
— · COMPONENT
PRODUCT OVERVIEW

N82S153F: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.302 INCHES MAXIMUM IN, body_height: 0.175 INCHES MAXIMUM IN, body_length: 0.990 INCHES MAXIMUM IN, features_provided: BURN IN AND PROGRAMMED, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-214-4461, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
N82S153F
NSN: 5962-01-214-4461
NIINs: 012144461, 012146188, 012146189, 013303536
FSC: 5962 — Microcircuits, Electronic
CAGE: 18324 — PHILIPS SEMICONDUCTORS INC (USA)
SPECIFICATIONS
body_width0.302 INCHES MAXIMUM IN
body_height0.175 INCHES MAXIMUM IN
body_length0.990 INCHES MAXIMUM IN
features_providedBURN IN AND PROGRAMMED
output_logic_formTRANSISTOR-TRANSISTOR LOGIC
inclosure_materialCERAMIC
memory_device_typePAL
storage_temp_range-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern8 INPUT
end_item_identificationRADAR SET AN/FPS-115
inclosure_configurationDUAL-IN-LINE
NSN5962-01-214-4461
COMPONENT DIAGRAM
COMPONENT MAIN IC EDGE CONNECTOR No detailed specs available MICROCIRCUIT,DIGITAL TITLE COMPONENT PN N82S153F MFR MICROCIRCUIT,DIGITAL
KEY FEATURES
•
INPUT CIRCUIT PATTERN: 8 INPUT
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INCLOSURE MATERIAL: CERAMIC AND GLASS
•
TERMINAL SURFACE TREATMENT: SOLDER
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BODY WIDTH: 0.302 INCHES MAXIMUM IN
•
BODY HEIGHT: 0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
•
FEATURES PROVIDED: 3-STATE OUTPUT AND PROGRAMMABLE AND BIDIRECTIONAL AND HERMETICALLY SEALED AND SCHOTTKY
•
INCLOSURE CONFIGURATION: DUAL-IN-LINE
•
MEMORY DEVICE TYPE: PAL
TECHNICAL CHARACTERISTICS
INPUT CIRCUIT PATTERN8 INPUT
INCLOSURE MATERIALCERAMIC AND GLASS
TERMINAL SURFACE TREATMENTSOLDER
BODY WIDTH0.302 INCHES MAXIMUM IN
BODY HEIGHT0.145 INCHES MINIMUM AND 0.175 INCHES MAXIMUM IN
FEATURES PROVIDED3-STATE OUTPUT AND PROGRAMMABLE AND BIDIRECTIONAL AND HERMETICALLY SEALED AND SCHOTTKY
INCLOSURE CONFIGURATIONDUAL-IN-LINE
MEMORY DEVICE TYPEPAL
BODY LENGTH0.942 INCHES MINIMUM AND 0.990 INCHES MAXIMUM IN
STORAGE TEMP RANGE-65.0 TO 150.0 CELSIUS DEGC
SUBSTITUTES & CROSS-REFERENCES 2
G284545-103Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
ROM/PROM FAMILY 158Reference document
Same NSN cross-reference
Reference document — Secondary reference
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation
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FREQUENTLY ASKED QUESTIONS
What is N82S153F?
N82S153F is a MICROCIRCUIT,DIGITAL.
What parts can replace N82S153F?
There are 2 known substitutes for N82S153F: G284545-103, ROM/PROM FAMILY 158. Substitute compatibility should be verified for your specific system.
What is the NSN for N82S153F?
N82S153F is cataloged in the U.S. Government catalog under NSN 5962-01-214-4461. This indicates validated use in U.S. government and defense supply chains.
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