MX618999-1-FD — MICROCIRCUIT,DIGITAL

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

MX618999-1-FD: MICROCIRCUIT,DIGITAL.

The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN, body_height: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN, body_length: 0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN, features_provided: MONOLITHIC AND HERMETICALLY SEALED AND EXPANDABLE AND BIPOLAR AND POSITIVE OUTPUTS, output_logic_form: DIODE-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-436-6445, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MX618999-1-FD

NSN: 5962-00-436-6445
FSC: 5962 — Microcircuits, Electronic
CAGE: 37695 — RAYTHEON COMPANY (USA)

SPECIFICATIONS

body_width	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
body_height	0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
body_length	0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN
features_provided	MONOLITHIC AND HERMETICALLY SEALED AND EXPANDABLE AND BIPOLAR AND POSITIVE OUTPUTS
output_logic_form	DIODE-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	8 INPUT
inclosure_configuration	FLAT PACK
terminal_surface_treatment	SOLDER
terminal_type_and_quantity	1 FLAT LEADS
NSN	5962-00-436-6445

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 8 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

DESIGN FUNCTION AND QUANTITY: 1 GATE, NAND

•

BODY WIDTH: 0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC AND HERMETICALLY SEALED AND EXPANDABLE AND BIPOLAR AND POSITIVE OUTPUTS

•

INCLOSURE CONFIGURATION: FLAT PACK

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	8 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
DESIGN FUNCTION AND QUANTITY	1 GATE, NAND
BODY WIDTH	0.240 INCHES MINIMUM AND 0.260 INCHES MAXIMUM IN
BODY HEIGHT	0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC AND HERMETICALLY SEALED AND EXPANDABLE AND BIPOLAR AND POSITIVE OUTPUTS
INCLOSURE CONFIGURATION	FLAT PACK
CASE OUTLINE SOURCE AND DESIGNATOR	T0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL
BODY LENGTH	0.240 INCHES MINIMUM AND 0.275 INCHES MAXIMUM IN

OTHER ITEMS IN FSC 5962 — Microcircuits, Electronic

Items in the same Federal Supply class. No interchangeability or substitution relationship is implied.

5962-00-001-1861 5962-00-001-1901 5962-00-001-1902 5962-00-001-1905 5962-00-001-1906 5962-00-001-1907 5962-00-001-1908 5962-00-001-1909

SUBSTITUTES & CROSS-REFERENCES 4

SC6939FH1Reference document

Same NSN cross-reference

Reference document — Secondary reference

MC1902FReference document

Same NSN cross-reference

Reference document — Secondary reference

DMS 83034BReference document

Same NSN cross-reference

Reference document — Secondary reference

1902/BABJCReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is MX618999-1-FD?

MX618999-1-FD is a MICROCIRCUIT,DIGITAL.

What parts can replace MX618999-1-FD?

There are 4 known substitutes for MX618999-1-FD: SC6939FH1, MC1902F, DMS 83034B and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for MX618999-1-FD?

MX618999-1-FD is cataloged in the U.S. Government catalog under NSN 5962-00-436-6445. This indicates validated use in U.S. government and defense supply chains.

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