The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.179 INCHES NOMINAL IN, mounting_method: TERMINAL, terminal_length: 0.594 INCHES NOMINAL IN, terminal_type_and_quantity: 2 UNINSULATED WIRE LEAD, power_rating_per_characteristic: 280.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-095-5855, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_length | 0.179 INCHES NOMINAL IN |
| mounting_method | TERMINAL |
| terminal_length | 0.594 INCHES NOMINAL IN |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| power_rating_per_characteristic | 280.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| current_rating_per_characteristic | 200.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 30.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS |
| maximum_operating_temp_per_measurement_point | 125.0 CELSIUS JUNCTION DEGC |
| NSN | 5961-01-095-5855 |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| MATERIAL | SILICON SEMICONDUCTOR |
| MATERIAL | PLASTIC ENCLOSURE |
| MOUNTING METHOD | TERMINAL |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 30.0 MAXIMUM REVERSE VOLTAGE, INSTANTANEOUS |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 CELSIUS JUNCTION DEGC |
| TERMINAL LENGTH | 0.594 INCHES NOMINAL IN |
| CURRENT RATING PER CHARACTERISTIC | 200.00 MILLIAMPERES MAXIMUM FORWARD CURRENT, DC |
| OVERALL LENGTH | 0.179 INCHES NOMINAL IN |
| POWER RATING PER CHARACTERISTIC | 280.0 MILLIWATTS MAXIMUM TOTAL DEVICE DISSIPATION |