The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: PLASTIC ENCLOSURE, overall_width: 0.375 INCHES NOMINAL IN, overall_height: 0.187 INCHES NOMINAL IN, overall_length: 0.593 INCHES NOMINAL IN, mounting_method: TERMINAL, terminal_length: 0.500 INCHES NOMINAL IN. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5961-01-326-4304, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC ENCLOSURE |
| overall_width | 0.375 INCHES NOMINAL IN |
| overall_height | 0.187 INCHES NOMINAL IN |
| overall_length | 0.593 INCHES NOMINAL IN |
| mounting_method | TERMINAL |
| terminal_length | 0.500 INCHES NOMINAL IN |
| terminal_type_and_quantity | 2 UNINSULATED WIRE LEAD |
| current_rating_per_characteristic | 16.00 AMPERES NOMINAL FORWARD CURRENT, DC |
| voltage_rating_in_volts_per_characteristic | 600.0 MAXIMUM REPETITIVE PEAK REVERSE VOLTAGE |
| maximum_operating_temp_per_measurement_point | 125.0 CELSIUS JUNCTION DEGC |
| joint_electronic_device_engineering_council/jedec/case_outline_designation | TO-220AC |
| NSN | 5961-01-326-4304 |
| MATERIAL | PLASTIC ENCLOSURE |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| MATERIAL | SILICON SEMICONDUCTOR |
| OVERALL HEIGHT | 0.187 INCHES NOMINAL IN |
| OVERALL WIDTH | 0.375 INCHES NOMINAL IN |
| OVERALL LENGTH | 0.593 INCHES NOMINAL IN |
| JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-220AC |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 125.0 CELSIUS JUNCTION DEGC |
| TERMINAL LENGTH | 0.500 INCHES NOMINAL IN |
| CURRENT RATING PER CHARACTERISTIC | 16.00 AMPERES NOMINAL FORWARD CURRENT, DC |