MR890 — SEMICONDUCTOR DEVICE,DIODE

✓ Government record, cited

— · SFP TRANSCEIVER

PRODUCT OVERVIEW

MR890: SEMICONDUCTOR DEVICE,DIODE.

The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_height: 0.450 INCHES MAXIMUM IN, overall_length: 0.450 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), features_provided: HERMETICALLY SEALED CASE, nominal_thread_size: 0.250 INCHES IN. This part is cataloged in the U.S.

Government catalog under NSN 5961-00-005-2957, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MR890

NSN: 5961-00-005-2957
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 04713 — FREESCALE SEMICONDUCTOR, INC. (USA)

SPECIFICATIONS

material	SILICON SEMICONDUCTOR
overall_height	0.450 INCHES MAXIMUM IN
overall_length	0.450 INCHES MAXIMUM IN
mounting_method	THREADED STUD(S)
features_provided	HERMETICALLY SEALED CASE
nominal_thread_size	0.250 INCHES IN
thread_series_designator	UNF
mounting_facility_quantity	1
overall_width_across_flats	0.687 INCHES MAXIMUM IN
terminal_type_and_quantity	1 THREADED STUD AND 1 UNINSULATED WIRE LEAD W/TERMINAL LUG
current_rating_per_characteristic	400.00 MILLIAMPERES MAXIMUM REPETITIVE PEAK FORWARD CURRENT
maximum_operating_temp_per_measurement_point	160.0 CELSIUS JUNCTION DEGC
NSN	5961-00-005-2957

COMPONENT DIAGRAM

KEY FEATURES

•

MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 160.0 CELSIUS JUNCTION DEGC

•

MOUNTING FACILITY QUANTITY: 1

•

MOUNTING METHOD: THREADED STUD(S)

•

FEATURES PROVIDED: HERMETICALLY SEALED CASE

•

OVERALL WIDTH ACROSS FLATS: 0.687 INCHES MAXIMUM IN

•

NOMINAL THREAD SIZE: 0.250 INCHES IN

TECHNICAL CHARACTERISTICS

OVERALL HEIGHT	0.450 INCHES MAXIMUM IN
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT	160.0 CELSIUS JUNCTION DEGC
MOUNTING FACILITY QUANTITY	1
MOUNTING METHOD	THREADED STUD(S)
OVERALL LENGTH	0.450 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED CASE
OVERALL WIDTH ACROSS FLATS	0.687 INCHES MAXIMUM IN
NOMINAL THREAD SIZE	0.250 INCHES IN
CURRENT RATING PER CHARACTERISTIC	400.00 MILLIAMPERES MAXIMUM REPETITIVE PEAK FORWARD CURRENT
MATERIAL	SILICON SEMICONDUCTOR

SUBSTITUTES & CROSS-REFERENCES 4

65802Reference document

Same NSN cross-reference

Reference document — Secondary reference

D621-EBReference document

Same NSN cross-reference

Reference document — Secondary reference

14493-19Reference document

Same NSN cross-reference

Reference document — Secondary reference

27818-3Reference document

Same NSN cross-reference

Reference document — Design control — primary reference

LIFECYCLE

NSN statusCancelled· U.S. Government catalog

Acquisition advice: Normally procured from the manufacturer (OEM)No demilitarization required

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FREQUENTLY ASKED QUESTIONS

What is MR890?

MR890 is a SEMICONDUCTOR DEVICE,DIODE.

What parts can replace MR890?

There are 4 known substitutes for MR890: 65802, D621-EB, 14493-19 and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for MR890?

MR890 is cataloged in the U.S. Government catalog under NSN 5961-00-005-2957. This indicates validated use in U.S. government and defense supply chains.

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MR890 — SEMICONDUCTOR DEVICE,DIODE

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