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MR824 — SEMICONDUCTOR DEVICE,DIODE

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

MR824: SEMICONDUCTOR DEVICE,DIODE.

The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_length: 0.246 INCHES MAXIMUM IN, mounting_method: TERMINAL, terminal_length: 1.010 INCHES MAXIMUM IN, overall_diameter: 0.405 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED CASE. This part is cataloged in the U.S.

Government catalog under NSN 5961-01-036-9236, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
MR824
NSN: 5961-01-036-9236
NIINs: 010369236, 010577427, 012160412
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 94990 — MOTOROLA INC. DBA INTEGRATED INFORMATION SYSTEMS GROUP (USA)
SPECIFICATIONS
materialSILICON SEMICONDUCTOR
overall_length0.246 INCHES MAXIMUM IN
mounting_methodTERMINAL
terminal_length1.010 INCHES MAXIMUM IN
overall_diameter0.405 INCHES MAXIMUM IN
features_providedHERMETICALLY SEALED CASE
terminal_type_and_quantity2 UNINSULATED WIRE LEAD
current_rating_per_characteristic1.00 AMPERES MAXIMUM FORWARD CURRENT, DC
voltage_rating_in_volts_per_characteristic400.0 MAXIMUM REVERSE VOLTAGE, PEAK
maximum_operating_temp_per_measurement_point175.0 CELSIUS JUNCTION DEGC
NSN5961-01-036-9236
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN MR824 MFR OEM SEMICONDUCTOR DEVICE,DIODE
KEY FEATURES
•
OVERALL DIAMETER: 0.395 INCHES MINIMUM AND 0.405 INCHES MAXIMUM IN
•
FEATURES PROVIDED: HERMETICALLY SEALED CASE
•
MATERIAL: SILICON SEMICONDUCTOR
•
TERMINAL TYPE AND QUANTITY: 2 UNINSULATED WIRE LEAD
TECHNICAL CHARACTERISTICS
OVERALL DIAMETER0.395 INCHES MINIMUM AND 0.405 INCHES MAXIMUM IN
OVERALL LENGTH0.234 INCHES MINIMUM AND 0.246 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED CASE
MATERIALSILICON SEMICONDUCTOR
TERMINAL TYPE AND QUANTITY2 UNINSULATED WIRE LEAD
SUBSTITUTES & CROSS-REFERENCES 6
524-340-011Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
588605-4Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
A4/65050/5838Reference document
Same NSN cross-reference
Reference document — Secondary reference
65050/5838Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
MR826Same NSN cross-reference
Same NSN cross-reference
Also cataloged under this NSN
588605-5Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
LIFECYCLE
NSN statusActive· U.S. Government catalog
Acquisition advice: Insurance item — stocked against contingency demandNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is MR824?
MR824 is a SEMICONDUCTOR DEVICE,DIODE.
What parts can replace MR824?
There are 6 known substitutes for MR824: 524-340-011, 588605-4, A4/65050/5838 and 3 more. Substitute compatibility should be verified for your specific system.
What is the NSN for MR824?
MR824 is cataloged in the U.S. Government catalog under NSN 5961-01-036-9236. This indicates validated use in U.S. government and defense supply chains.
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