The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include features_provided: HIGH SPEED AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE, memory_device_type: PROM, test_data_document: 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.)., operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC, inclosure_configuration: LEADLESS FLAT PACK, terminal_type_and_quantity: 32 FLAT LEADS. This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-254-7869, indicating validated use in U.S.
government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels. Verify compatibility with your specific system configuration before ordering.
| features_provided | HIGH SPEED AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE |
| memory_device_type | PROM |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_type_and_quantity | 32 FLAT LEADS |
| voltage_rating_and_type_per_characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| NSN | 5962-01-254-7869 |
| FEATURES PROVIDED | HIGH SPEED AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| MEMORY DEVICE TYPE | PROM |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| TERMINAL TYPE AND QUANTITY | 32 FLAT LEADS |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |