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MR1366 — SEMICONDUCTOR DEVICE,DIODE

✓ Government record, cited
— · SFP TRANSCEIVER
PRODUCT OVERVIEW

MR1366: SEMICONDUCTOR DEVICE,DIODE.

The SEMICONDUCTOR DEVICE,DIODE is a the manufacturer industrial component. Key specifications include material: GLASS ENCLOSURE, overall_length: 0.405 INCHES MAXIMUM IN, mounting_method: THREADED STUD(S), features_provided: HERMETICALLY SEALED CASE, nominal_thread_size: 0.190 INCHES IN, thread_series_designator: UNF. This part is cataloged in the U.S.

Government catalog under NSN 5961-01-008-4877, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS
MR1366
NSN: 5961-01-008-4877
FSC: 5961 — Semiconductor Devices and Associated Hardware
CAGE: 04713 — FREESCALE SEMICONDUCTOR, INC. (USA)
SPECIFICATIONS
materialGLASS ENCLOSURE
overall_length0.405 INCHES MAXIMUM IN
mounting_methodTHREADED STUD(S)
features_providedHERMETICALLY SEALED CASE
nominal_thread_size0.190 INCHES IN
thread_series_designatorUNF
mounting_facility_quantity1
overall_width_across_flats0.424 INCHES MINIMUM AND 0.437 INCHES MAXIMUM IN
terminal_type_and_quantity1 THREADED STUD AND 1 TAB, SOLDER LUG
current_rating_per_characteristic12.00 AMPERES MAXIMUM FORWARD CURRENT, AVERAGE
voltage_rating_in_volts_per_characteristic600.0 MAXIMUM REVERSE VOLTAGE, PEAK
maximum_operating_temp_per_measurement_point150.0 CELSIUS JUNCTION DEGC
NSN5961-01-008-4877
COMPONENT DIAGRAM
BAIL LATCH 10G SFP+ 850nm · SR (MMF, 300m) DOM: Digital Optical Monitoring TX RX LC DUPLEX 20-PIN EDGE CONNECTOR ~56.5 mm ~13.4mm SFP+ TRANSCEIVER | 10G | 850nm | SR (MMF, 300m) Hot-swappable | LC duplex fiber | DDM/DOM supported TITLE SFP+ XCVR PN MR1366 MFR OEM SEMICONDUCTOR DEVICE,DIODE
KEY FEATURES
•
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC: 600.0 MAXIMUM REVERSE VOLTAGE, PEAK
•
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT: 150.0 CELSIUS JUNCTION DEGC
•
MOUNTING FACILITY QUANTITY: 1
•
MOUNTING METHOD: THREADED STUD(S)
•
FEATURES PROVIDED: HERMETICALLY SEALED CASE
•
OVERALL WIDTH ACROSS FLATS: 0.424 INCHES MINIMUM AND 0.437 INCHES MAXIMUM IN
•
NOMINAL THREAD SIZE: 0.190 INCHES IN
TECHNICAL CHARACTERISTICS
VOLTAGE RATING IN VOLTS PER CHARACTERISTIC600.0 MAXIMUM REVERSE VOLTAGE, PEAK
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT150.0 CELSIUS JUNCTION DEGC
MOUNTING FACILITY QUANTITY1
MOUNTING METHODTHREADED STUD(S)
OVERALL LENGTH0.405 INCHES MAXIMUM IN
FEATURES PROVIDEDHERMETICALLY SEALED CASE
OVERALL WIDTH ACROSS FLATS0.424 INCHES MINIMUM AND 0.437 INCHES MAXIMUM IN
NOMINAL THREAD SIZE0.190 INCHES IN
CURRENT RATING PER CHARACTERISTIC12.00 AMPERES MAXIMUM FORWARD CURRENT, AVERAGE
MATERIALSILICON SEMICONDUCTOR
SUBSTITUTES & CROSS-REFERENCES 1
MR1376Reference document
Same NSN cross-reference
Reference document — Advisory reference — outside the item-of-supply concept
LIFECYCLE
NSN statusCancelled· U.S. Government catalog
Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedNo demilitarization required
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FREQUENTLY ASKED QUESTIONS
What is MR1366?
MR1366 is a SEMICONDUCTOR DEVICE,DIODE.
What parts can replace MR1366?
There is 1 known substitute for MR1366: MR1376. Substitute compatibility should be verified for your specific system.
What is the NSN for MR1366?
MR1366 is cataloged in the U.S. Government catalog under NSN 5961-01-008-4877. This indicates validated use in U.S. government and defense supply chains.
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