MPZ5-32C: SEMICONDUCTOR DEVICE ASSEMBLY.
The SEMICONDUCTOR DEVICE ASSEMBLY is a the manufacturer industrial component. Key specifications include material: SILICON SEMICONDUCTOR, overall_width: 1.510 INCHES MAXIMUM IN, overall_height: 0.670 INCHES MAXIMUM IN, overall_length: 1.510 INCHES MAXIMUM IN, mounting_method: UNTHREADED HOLE(S), major_components: DIODE 6; HEATSINK 1. This part is cataloged in the U.S.
Government catalog under NSN 5961-00-442-4222, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | SILICON SEMICONDUCTOR |
| overall_width | 1.510 INCHES MAXIMUM IN |
| overall_height | 0.670 INCHES MAXIMUM IN |
| overall_length | 1.510 INCHES MAXIMUM IN |
| mounting_method | UNTHREADED HOLE(S) |
| major_components | DIODE 6; HEATSINK 1 |
| special_features | SIX ZENER DIODES MTD BETWEEN 2 BOARDS; 2.000 IN.,1.500 IN.,0.480 IN. O/A ASSEMBLY DIM. IN |
| features_provided | HERMETICALLY SEALED CASE |
| mounting_facility_quantity | 4 |
| terminal_type_and_quantity | 1 TAB, SOLDER LUG AND 1 CASE |
| power_rating_per_characteristic | 350.0 WATTS MAXIMUM TOTAL POWER DISSIPATION |
| current_rating_per_characteristic | 1.25 AMPERES MAXIMUM VOLTAGE REGULATOR DIODE CURRENT |
| NSN | 5961-00-442-4222 |
| OVERALL HEIGHT | 0.650 INCHES MAXIMUM IN |
| MAJOR COMPONENTS | DIODE 6; HEATSINK 1 |
| OVERALL LENGTH | 1.990 INCHES MINIMUM AND 2.010 INCHES MAXIMUM IN |
| OVERALL WIDTH | 1.490 INCHES MINIMUM AND 1.510 INCHES MAXIMUM IN |