MPD18403FK: MICROCIRCUIT,DIGITAL.
The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, body_height: 0.054 INCHES MINIMUM AND 0.088 INCHES MAXIMUM IN, body_length: 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC, storage_temp_range: -65.0 TO 125.0 CELSIUS DEGC. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-413-4332, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN |
| body_height | 0.054 INCHES MINIMUM AND 0.088 INCHES MAXIMUM IN |
| body_length | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN |
| output_logic_form | TRANSISTOR-TRANSISTOR LOGIC |
| inclosure_material | CERAMIC |
| storage_temp_range | -65.0 TO 125.0 CELSIUS DEGC |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | LEADLESS FLAT PACK |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 20 LEADLESS |
| design_function_and_quantity | 1 COUNTER, UP/DOWN |
| time_rating_per_chacteristic | 21.00 NANOSECONDS MAXIMUM ACCESS NS |
| NSN | 5962-01-413-4332 |
| INCLOSURE MATERIAL | CERAMIC |
| TERMINAL SURFACE TREATMENT | SOLDER |
| DESIGN FUNCTION AND QUANTITY | 1 COUNTER, UP/DOWN |
| BODY WIDTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.054 INCHES MINIMUM AND 0.088 INCHES MAXIMUM IN |
| INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CURRENT RATING PER CHARACTERISTIC | 32.00 MICROAMPERES MAXIMUM SUPPLY |
| BODY LENGTH | 0.342 INCHES MINIMUM AND 0.358 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -65.0 TO 125.0 CELSIUS DEGC |
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |