MP1272008: ADHESIVE.
The ADHESIVE is a the manufacturer industrial component. Key specifications include material: PLASTIC EPOXY, physical_form: PASTE, special_features: SILVER FILLED; ELECTRICALLY CONDUCTIVE; RIGID, features_provided: SEPARATE CATALYST, rated_drying_time: 24.000 HOURS NOMINAL, specific_usage_design: FOR ELECTRONICS BONDING APPLICATIONS. This part is cataloged in the U.S.
Government catalog under NSN 8040-00-764-7475, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| material | PLASTIC EPOXY |
| physical_form | PASTE |
| special_features | SILVER FILLED; ELECTRICALLY CONDUCTIVE; RIGID |
| features_provided | SEPARATE CATALYST |
| rated_drying_time | 24.000 HOURS NOMINAL |
| specific_usage_design | FOR ELECTRONICS BONDING APPLICATIONS |
| supplementary_features | STORE AT 72 DEGREES F |
| quantity_within_each_unit_package | 1.000 POUNDS LBS |
| NSN | 8040-00-764-7475 |
| RATED DRYING TIME | 24.000 HOURS NOMINAL |
| SUPPLEMENTARY FEATURES | STORE AT 72 DEGREES F |
| FEATURES PROVIDED | SEPARATE CATALYST |
| QUANTITY WITHIN EACH UNIT PACKAGE | 1.000 POUNDS LBS |
| PHYSICAL FORM | PASTE |
| COLOR | GRAY/GREY |
| SPECIAL FEATURES | SILVER FILLED; ELECTRICALLY CONDUCTIVE; RIGID |
| SPECIFIC USAGE DESIGN | FOR ELECTRONICS BONDING APPLICATIONS |
| MATERIAL | PLASTIC EPOXY |