The MICROCIRCUIT,DIGITAL is a the manufacturer industrial component. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MAXIMUM IN, body_length: 1.060 INCHES MAXIMUM IN, features_provided: HIGH SPEED AND 3-STATE OUTPUT AND MONOLITHIC AND W/CLOCK, output_logic_form: COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC AND GLASS. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System under NSN 5962-01-189-4489, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_height | 0.140 INCHES MAXIMUM IN |
| body_length | 1.060 INCHES MAXIMUM IN |
| features_provided | HIGH SPEED AND 3-STATE OUTPUT AND MONOLITHIC AND W/CLOCK |
| output_logic_form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC AND GLASS |
| storage_temp_range | -65.0 TO 150.0 CELSIUS DEGC |
| test_data_document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| input_circuit_pattern | 10 INPUT |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| NSN | 5962-01-189-4489 |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| DESIGN FUNCTION AND QUANTITY | 1 FLIP-FLOP |
| INCLOSURE MATERIAL | SILICON |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |