The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_length: 0.740 INCHES MINIMUM AND 0.810 INCHES MAXIMUM IN, features_provided: MONOLITHIC, inclosure_material: CERAMIC, memory_device_type: ROM, operating_temp_range: -55.0 TO 125.0 CELSIUS DEGC. This product is currently in active production with full OEM support.
This part is cataloged in the Federal Logistics Information System (FLIS) under NSN 5962-01-047-8669, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| body_length | 0.740 INCHES MINIMUM AND 0.810 INCHES MAXIMUM IN |
| features_provided | MONOLITHIC |
| inclosure_material | CERAMIC |
| memory_device_type | ROM |
| operating_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| inclosure_configuration | DUAL-IN-LINE |
| terminal_surface_treatment | SOLDER |
| terminal_type_and_quantity | 16 PRINTED CIRCUIT |
| NSN | 5962-01-047-8669 |
| BODY LENGTH | 0.740 INCHES MINIMUM AND 0.810 INCHES MAXIMUM IN |
| MEMORY DEVICE TYPE | ROM |
| TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| BODY WIDTH | 0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN |
| OPERATING TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |
| FEATURES PROVIDED | MONOLITHIC |
| INCLOSURE MATERIAL | CERAMIC |