MM5205-737758-9 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

MM5205-737758-9: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN, body_length: 0.896 INCHES MAXIMUM IN, output_logic_form: TRANSISTOR-TRANSISTOR LOGIC, inclosure_material: CERAMIC AND GLASS, memory_device_type: ROM. This part is cataloged in the U.S.

Government catalog under NSN 5962-00-506-6492, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MM5205-737758-9

NSN: 5962-00-506-6492
FSC: 5962 — Microcircuits, Electronic
CAGE: 50364 — MMI/AMD (USA)

SPECIFICATIONS

body_width	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
body_length	0.896 INCHES MAXIMUM IN
output_logic_form	TRANSISTOR-TRANSISTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	10 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
time_rating_per_chacteristic	85.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT NS
NSN	5962-00-506-6492

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 10 INPUT

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

•

CASE OUTLINE SOURCE AND DESIGNATOR: D-2 MIL-M-38510

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	10 INPUT
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM IN
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
CASE OUTLINE SOURCE AND DESIGNATOR	D-2 MIL-M-38510
BODY LENGTH	0.896 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

737758-9Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

G4359Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

ROM/PROM FAMILY 025Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is MM5205-737758-9?

MM5205-737758-9 is a MICROCIRCUIT,MEMORY.

What parts can replace MM5205-737758-9?

There are 3 known substitutes for MM5205-737758-9: 737758-9, G4359, ROM/PROM FAMILY 025. Substitute compatibility should be verified for your specific system.

What is the NSN for MM5205-737758-9?

MM5205-737758-9 is cataloged in the U.S. Government catalog under NSN 5962-00-506-6492. This indicates validated use in U.S. government and defense supply chains.

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