MKB36000P — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

MKB36000P: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.568 INCHES MINIMUM AND 0.588 INCHES MAXIMUM IN, body_height: 0.075 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN, body_length: 1.185 INCHES MINIMUM AND 1.215 INCHES MAXIMUM IN, features_provided: PROGRAMMABLE, output_logic_form: METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: PLASTIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-181-3104, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MKB36000P

NSN: 5962-01-181-3104
NIINs: 011813104, 011813105, 011826587
FSC: 5962 — Microcircuits, Electronic
CAGE: 50088 — STMICROELECTRONICS INC (USA)

SPECIFICATIONS

body_width	0.568 INCHES MINIMUM AND 0.588 INCHES MAXIMUM IN
body_height	0.075 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
body_length	1.185 INCHES MINIMUM AND 1.215 INCHES MAXIMUM IN
features_provided	PROGRAMMABLE
output_logic_form	METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	PLASTIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-30.0 TO 85.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
end_item_identification	5815-01-062-8194 COMMUNICATIONS TERMINAL
inclosure_configuration	DUAL-IN-LINE
NSN	5962-01-181-3104

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: PLASTIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.568 INCHES MINIMUM AND 0.588 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.075 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN

•

FEATURES PROVIDED: MONOLITHIC

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	PLASTIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.568 INCHES MINIMUM AND 0.588 INCHES MAXIMUM IN
BODY HEIGHT	0.075 INCHES MINIMUM AND 0.085 INCHES MAXIMUM IN
FEATURES PROVIDED	MONOLITHIC
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.185 INCHES MINIMUM AND 1.215 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 3

MKX36220P80Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

SM-C-915902Reference document

Same NSN cross-reference

Reference document — Secondary reference

DMS 86067BReference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — critical (Q)

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FREQUENTLY ASKED QUESTIONS

What is MKB36000P?

MKB36000P is a MICROCIRCUIT,MEMORY.

What parts can replace MKB36000P?

There are 3 known substitutes for MKB36000P: MKX36220P80, SM-C-915902, DMS 86067B. Substitute compatibility should be verified for your specific system.

What is the NSN for MKB36000P?

MKB36000P is cataloged in the U.S. Government catalog under NSN 5962-01-181-3104. This indicates validated use in U.S. government and defense supply chains.

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