MKB36000J-84 — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

MKB36000J-84: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.090 INCHES MAXIMUM IN, body_length: 1.150 INCHES MINIMUM AND 1.250 INCHES MAXIMUM IN, features_provided: HERMETICALLY SEALED, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC, inclosure_material: CERAMIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-116-8853, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MKB36000J-84

NSN: 5962-01-116-8853
FSC: 5962 — Microcircuits, Electronic
CAGE: 50088 — STMICROELECTRONICS INC (USA)

SPECIFICATIONS

body_width	0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
body_height	0.090 INCHES MAXIMUM IN
body_length	1.150 INCHES MINIMUM AND 1.250 INCHES MAXIMUM IN
features_provided	HERMETICALLY SEALED
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	-55.0 TO 125.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
inclosure_configuration	DUAL-IN-LINE
terminal_surface_treatment	SOLDER
NSN	5962-01-116-8853

COMPONENT DIAGRAM

KEY FEATURES

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

INCLOSURE MATERIAL: CERAMIC

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.090 INCHES MAXIMUM IN

•

FEATURES PROVIDED: HERMETICALLY SEALED

•

INCLOSURE CONFIGURATION: DUAL-IN-LINE

•

MEMORY DEVICE TYPE: ROM

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

INPUT CIRCUIT PATTERN	14 INPUT
INCLOSURE MATERIAL	CERAMIC
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.580 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN
BODY HEIGHT	0.090 INCHES MAXIMUM IN
FEATURES PROVIDED	HERMETICALLY SEALED
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM
BODY LENGTH	1.150 INCHES MINIMUM AND 1.250 INCHES MAXIMUM IN
STORAGE TEMP RANGE	-65.0 TO 150.0 CELSIUS DEGC

SUBSTITUTES & CROSS-REFERENCES 4

647-2566-002Reference document

Same NSN cross-reference

Reference document — Secondary reference

DMS 86067BReference document

Same NSN cross-reference

Reference document — Secondary reference

MKB36940P-84Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

351-8793-022Same NSN cross-reference

Same NSN cross-reference

Also cataloged under this NSN

LIFECYCLE

NSN statusCancelled· U.S. Government catalog

Acquisition advice: Terminal item — no further procurement; issued until stock is exhaustedDemilitarization required — mutilation + specific procedure

Ready to buy MKB36000J-84?

Compare prices from verified sellers on eBay

Buy on eBay →

As an eBay Partner, PartsTable may earn a commission. Your price is not affected.

FREQUENTLY ASKED QUESTIONS

What is MKB36000J-84?

MKB36000J-84 is a MICROCIRCUIT,MEMORY.

What parts can replace MKB36000J-84?

There are 4 known substitutes for MKB36000J-84: 647-2566-002, DMS 86067B, MKB36940P-84 and 1 more. Substitute compatibility should be verified for your specific system.

What is the NSN for MKB36000J-84?

MKB36000J-84 is cataloged in the U.S. Government catalog under NSN 5962-01-116-8853. This indicates validated use in U.S. government and defense supply chains.

Community Feedback

MKB36000J-84 — MICROCIRCUIT,MEMORY

Request a Quote — MKB36000J-84