MKB2716T-8: MICROCIRCUIT,MEMORY.
The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN, body_height: 0.160 INCHES MINIMUM AND 0.220 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, bit_quantity: 16384, word_quantity: 2048, overall_length: 1.290 INCHES MAXIMUM IN. This part is cataloged in the U.S.
Government catalog under NSN 5962-01-146-8999, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.
Verify compatibility with your specific system configuration before ordering.
| body_width | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| body_height | 0.160 INCHES MINIMUM AND 0.220 INCHES MAXIMUM IN |
| body_length | 1.290 INCHES MAXIMUM IN |
| bit_quantity | 16384 |
| word_quantity | 2048 |
| overall_length | 1.290 INCHES MAXIMUM IN |
| memory_capacity | UNKNOWN |
| features_provided | HERMETICALLY SEALED AND BURN IN AND ELECTROSTATIC SENSITIVE AND ULTRAVIOLET ERASABLE |
| output_logic_form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| inclosure_material | CERAMIC |
| memory_device_type | EPROM |
| storage_temp_range | -55.0 TO 125.0 CELSIUS DEGC |
| NSN | 5962-01-146-8999 |
| INPUT CIRCUIT PATTERN | 13 INPUT |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM IN |
| BODY HEIGHT | 0.220 INCHES MAXIMUM IN |
| FEATURES PROVIDED | BURN IN, MIL-STD-883, CLASS B AND ELECTROSTATIC SENSITIVE AND ERASABLE AND HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND ULTRAVIOLET ERASABLE AND W/TRANSPARENT LID AND 3-STATE OUTPUT |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| MEMORY DEVICE TYPE | ROM |
| BODY LENGTH | 1.290 INCHES MAXIMUM IN |
| STORAGE TEMP RANGE | -55.0 TO 125.0 CELSIUS DEGC |