MK31000P — MICROCIRCUIT,MEMORY

✓ Government record, cited

— · COMPONENT

PRODUCT OVERVIEW

MK31000P: MICROCIRCUIT,MEMORY.

The MICROCIRCUIT,MEMORY is a the manufacturer memory module engineered for enterprise server and workstation platforms requiring validated, high-reliability memory. Key specifications include body_width: 0.590 INCHES MINIMUM AND 0.625 INCHES MAXIMUM IN, body_height: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN, body_length: 1.290 INCHES MAXIMUM IN, bit_quantity: 16384, word_quantity: 2048, output_logic_form: N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC. This part is cataloged in the U.S.

Government catalog under NSN 5962-01-082-2006, indicating validated use in U.S. government and defense logistics supply chains. Available through authorized enterprise resellers and TPM (Third Party Maintenance) channels.

Verify compatibility with your specific system configuration before ordering.

WHERE IT FITS

MK31000P

NSN: 5962-01-082-2006
NIINs: 010822006, 010822008
FSC: 5962 — Microcircuits, Electronic
CAGE: 50088 — STMICROELECTRONICS INC (USA)

SPECIFICATIONS

body_width	0.590 INCHES MINIMUM AND 0.625 INCHES MAXIMUM IN
body_height	0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
body_length	1.290 INCHES MAXIMUM IN
bit_quantity	16384
word_quantity	2048
features_provided	ASYNCHRONOUS AND HERMETICALLY SEALED AND HIGH PERFORMANCE AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND 3-STATE OUTPUT
output_logic_form	N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
inclosure_material	CERAMIC AND GLASS
memory_device_type	ROM
storage_temp_range	-65.0 TO 150.0 CELSIUS DEGC
operating_temp_range	+0.0 TO 70.0 CELSIUS DEGC
input_circuit_pattern	14 INPUT
NSN	5962-01-082-2006

COMPONENT DIAGRAM

KEY FEATURES

•

BIT QUANTITY: 16384

•

INPUT CIRCUIT PATTERN: 14 INPUT

•

WORD QUANTITY: 2048

•

INCLOSURE MATERIAL: CERAMIC AND GLASS

•

TERMINAL SURFACE TREATMENT: SOLDER

•

BODY WIDTH: 0.590 INCHES MINIMUM AND 0.625 INCHES MAXIMUM IN

•

BODY HEIGHT: 0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN

•

FEATURES PROVIDED: STATIC OPERATION AND 3-STATE OUTPUT AND PROGRAMMABLE AND HIGH PERFORMANCE AND ASYNCHRONOUS

TYPICAL APPLICATIONS

Server memory expansion for virtualization workloads
Database performance optimization (in-memory computing)
VDI and remote desktop session hosting
High-performance computing (HPC) clusters
Mail server and collaboration platform scaling
Application server tier expansion

TECHNICAL CHARACTERISTICS

BIT QUANTITY	16384
INPUT CIRCUIT PATTERN	14 INPUT
WORD QUANTITY	2048
INCLOSURE MATERIAL	CERAMIC AND GLASS
TERMINAL SURFACE TREATMENT	SOLDER
BODY WIDTH	0.590 INCHES MINIMUM AND 0.625 INCHES MAXIMUM IN
BODY HEIGHT	0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM IN
FEATURES PROVIDED	STATIC OPERATION AND 3-STATE OUTPUT AND PROGRAMMABLE AND HIGH PERFORMANCE AND ASYNCHRONOUS
INCLOSURE CONFIGURATION	DUAL-IN-LINE
MEMORY DEVICE TYPE	ROM

SUBSTITUTES & CROSS-REFERENCES 2

SYC2316AReference document

Same NSN cross-reference

Reference document — Secondary reference

1818-0266Reference document

Same NSN cross-reference

Reference document — Secondary reference

LIFECYCLE

NSN statusActive· U.S. Government catalog

Acquisition advice: Insurance item — stocked against contingency demandDemilitarization required — mutilation + specific procedure

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FREQUENTLY ASKED QUESTIONS

What is MK31000P?

MK31000P is a MICROCIRCUIT,MEMORY.

What parts can replace MK31000P?

There are 2 known substitutes for MK31000P: SYC2316A, 1818-0266. Substitute compatibility should be verified for your specific system.

What is the NSN for MK31000P?

MK31000P is cataloged in the U.S. Government catalog under NSN 5962-01-082-2006. This indicates validated use in U.S. government and defense supply chains.

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